(module Elabdev:TSNP-6_0.7x1.1mm_P0.4mm (layer F.Cu) (tedit 5F8F5390)
  (descr "Thin Small Nonleaded (TSNP) Package, 6 contact plastic leadless (0.7mm x 1.1mm), https://www.infineon.com/dgdl/Infineon-Board_Assembly_Recommendations-TSNP-Package-v01_00-EN.pdf")
  (tags TSNP)
  (attr smd)
  (fp_text reference REF** (at 0 -2) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value TSNP-6_0.7x1.1mm_P0.4mm (at 0 2) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start -0.35 -0.55) (end 0.35 -0.55) (layer F.Fab) (width 0.1))
  (fp_line (start -0.35 0.55) (end -0.35 -0.55) (layer F.Fab) (width 0.1))
  (fp_line (start 0.35 0.55) (end -0.35 0.55) (layer F.Fab) (width 0.1))
  (fp_line (start 0.35 -0.55) (end 0.35 0.55) (layer F.Fab) (width 0.1))
  (fp_line (start 0.4 -0.6) (end -0.4 -0.6) (layer F.SilkS) (width 0.1))
  (fp_line (start -0.4 0.6) (end -0.4 -0.6) (layer F.SilkS) (width 0.1))
  (fp_line (start 0.4 0.6) (end 0 0.6) (layer F.SilkS) (width 0.1))
  (fp_line (start 0.4 0.6) (end 0.4 0.2) (layer F.SilkS) (width 0.1))
  (fp_line (start -0.6 0.8) (end -0.6 -0.8) (layer F.CrtYd) (width 0.05))
  (fp_line (start 0.6 0.8) (end -0.6 0.8) (layer F.CrtYd) (width 0.05))
  (fp_line (start 0.6 -0.8) (end 0.6 0.8) (layer F.CrtYd) (width 0.05))
  (fp_line (start -0.6 -0.8) (end 0.6 -0.8) (layer F.CrtYd) (width 0.05))
  (fp_text user %R (at 0 1.27) (layer F.Fab)
    (effects (font (size 0.4 0.4) (thickness 0.04)))
  )
  (pad 4 smd rect (at -0.2 -0.4) (size 0.25 0.25) (layers F.Cu F.Mask)
    (solder_paste_margin -0.05))
  (pad 2 smd rect (at 0.2 0) (size 0.25 0.25) (layers F.Cu F.Mask)
    (solder_paste_margin -0.05))
  (pad 1 smd rect (at 0.2 0.4) (size 0.25 0.25) (layers F.Cu F.Mask)
    (solder_paste_margin -0.05))
  (pad 3 smd rect (at 0.2 -0.4) (size 0.25 0.25) (layers F.Cu F.Mask)
    (solder_paste_margin -0.05))
  (pad 5 smd rect (at -0.2 0) (size 0.25 0.25) (layers F.Cu F.Mask)
    (solder_paste_margin -0.05))
  (pad 6 smd rect (at -0.2 0.4) (size 0.25 0.25) (layers F.Cu F.Mask)
    (solder_paste_margin -0.05))
  (pad 2 smd circle (at 0.2 0) (size 0.25 0.25) (layers F.Cu F.Paste)
    (solder_paste_margin -0.05))
  (pad 1 smd circle (at 0.2 0.4) (size 0.25 0.25) (layers F.Cu F.Paste)
    (solder_paste_margin -0.05))
  (pad 3 smd circle (at 0.2 -0.4) (size 0.25 0.25) (layers F.Cu F.Paste)
    (solder_paste_margin -0.05))
  (pad 4 smd circle (at -0.2 -0.4) (size 0.25 0.25) (layers F.Cu F.Paste)
    (solder_paste_margin -0.05))
  (pad 5 smd circle (at -0.2 0) (size 0.25 0.25) (layers F.Cu F.Paste)
    (solder_paste_margin -0.05))
  (pad 6 smd circle (at -0.2 0.4) (size 0.25 0.25) (layers F.Cu F.Paste)
    (solder_paste_margin -0.05))
)
