From 425ff0092ad9e43d7c0b3314a51291cee4f8800b Mon Sep 17 00:00:00 2001 From: Michael Schloh von Bennewitz Date: Thu, 3 Sep 2020 16:58:11 +0200 Subject: [PATCH] Add MCU part symbols and missing BGA footprint to project libraries. --- hardware/libraries/elabdev.dcm | 31 +++ hardware/libraries/elabdev.lib | 194 ++++++++++++++++++ .../TFBGA-64_8x8_6.0x6.0mm_P0.65mm.kicad_mod | 101 +++++++++ 3 files changed, 326 insertions(+) create mode 100644 hardware/libraries/elabdev.dcm create mode 100644 hardware/modules/elabdev.pretty/TFBGA-64_8x8_6.0x6.0mm_P0.65mm.kicad_mod diff --git a/hardware/libraries/elabdev.dcm b/hardware/libraries/elabdev.dcm new file mode 100644 index 0000000..c166bc2 --- /dev/null +++ b/hardware/libraries/elabdev.dcm @@ -0,0 +1,31 @@ +EESchema-DOCLIB Version 2.0 +# +$CMP ATSAMR34 +D SAM R34/R35 Low Power LoRa Sub-GHz System-in-Package (SiP), Cortex-M0+ core, 256kB Flash, 40 KB RAM, 6x6mm TFBGA-64 +K Atmel UHF Transceiver Microcontroller +F https://ww1.microchip.com/downloads/en/DeviceDoc/SAMR34-R35-Low-Power-LoRa-Sub-GHz-SiP-Data-Sheet-DS70005356B.pdf +$ENDCMP +# +$CMP ST25DV04K-JF +D 13.56 MHz long-range interface dynamic NFC/RFID tag, Package: UFDFPN-8, EEPROM: 5 kb, Voltage: 1,8..5,5V, I/O pins: 8 +K ST25DV-I2C series Dynamic NFC Tag +F https://www.st.com/resource/datasheet/st25dv04k.pdf +$ENDCMP +# +$CMP STM32WLE5C +D LPWAN Arm Cortex-M4 MCUs, LoRa, (G)FSK, (G)MSK, BPSK, 64/128/256KB Flash, 64KB SRAM, 7x7mm UFQFPN-48 +K STM32 UHF Transceiver Microcontroller +F https://www.st.com/resource/datasheet/stm32wle5jc.pdf +$ENDCMP +# +$CMP Soldfeld +D Solder Area +K sf solder feld +$ENDCMP +# +$CMP USBCHole +D USB Type C Hole +K usb hole +$ENDCMP +# +#End Doc Library diff --git a/hardware/libraries/elabdev.lib b/hardware/libraries/elabdev.lib index e69de29..e029cbd 100644 --- a/hardware/libraries/elabdev.lib +++ b/hardware/libraries/elabdev.lib @@ -0,0 +1,194 @@ +EESchema-LIBRARY Version 2.4 +#encoding utf-8 +# +# ATSAMR34 +# +DEF ATSAMR34 U 0 40 Y Y 1 F N +F0 "U" -700 1800 50 H V L CNN +F1 "ATSAMR34" 700 1800 50 H V R CNN +F2 "Elabdev:TFBGA-64_8x8_6.0x6.0mm_P0.65mm" -50 0 50 V I C CIN +F3 "https://www.microchip.com/wwwproducts/ATSAMR34J18/" 50 0 50 V I C CNN +$FPLIST + TFBGA*8x8mm*P0.65mm* +$ENDFPLIST +DRAW +S -700 1700 700 -1700 0 1 10 f +X RFI_HF A1 -800 1600 100 R 50 50 0 0 I +X GND_RF A2 -800 1500 100 R 50 50 0 0 W +X PA00 A3 -800 1400 100 R 50 50 0 0 I +X PA01 A4 -800 1300 100 R 50 50 0 0 I +X VDDCORE A5 -800 1200 100 R 50 50 0 0 I +X VSW A6 -800 1100 100 R 50 50 0 0 I +X VDDIN A7 -800 1000 100 R 50 50 0 0 I +X VDDIO2 A8 -800 900 100 R 50 50 0 0 I +X RFO_HF B1 -800 800 100 R 50 50 0 0 I +X GND_RF B2 -800 700 100 R 50 50 0 0 I +X GNDANA B3 -800 600 100 R 50 50 0 0 I +X PB02 B4 -800 500 100 R 50 50 0 0 I +X GND B5 -800 400 100 R 50 50 0 0 I +X RESET B6 -800 300 100 R 50 50 0 0 I +X GND B7 -800 200 100 R 50 50 0 0 I +X PA24 B8 -800 100 100 R 50 50 0 0 I +X VBAT_RF C1 -800 -100 100 R 50 50 0 0 I +X VDDANA C2 -800 -200 100 R 50 50 0 0 I +X PB03 C3 -800 -300 100 R 50 50 0 0 I +X PA05 C4 -800 -400 100 R 50 50 0 0 I +X PA30 C5 -800 -500 100 R 50 50 0 0 I +X PA28 C6 -800 -600 100 R 50 50 0 0 I +X PB23 C7 -800 -700 100 R 50 50 0 0 I +X PA25 C8 -800 -800 100 R 50 50 0 0 I +X VR_PA D1 -800 -900 100 R 50 50 0 0 I +X RXTX D2 -800 -1000 100 R 50 50 0 0 I +X PA04 D3 -800 -1100 100 R 50 50 0 0 I +X GND D4 -800 -1200 100 R 50 50 0 0 I +X PA31 D5 -800 -1300 100 R 50 50 0 0 I +X GND D6 -800 -1400 100 R 50 50 0 0 I +X PA23 D7 -800 -1500 100 R 50 50 0 0 I +X PA22 D8 -800 -1600 100 R 50 50 0 0 I +X GND_RF E1 800 1600 100 L 50 50 0 0 I +X GNDANA E2 800 1500 100 L 50 50 0 0 I +X PA06 E3 800 1400 100 L 50 50 0 0 I +X PA27 E4 800 1300 100 L 50 50 0 0 I +X PB22 E5 800 1200 100 L 50 50 0 0 I +X PA17 E6 800 1100 100 L 50 50 0 0 I +X PA18 E7 800 1000 100 L 50 50 0 0 I +X PA19 E8 800 900 100 L 50 50 0 0 I +X PA_BOOST F1 800 800 100 L 50 50 0 0 I +X GND_RF F2 800 700 100 L 50 50 0 0 I +X PA07 F3 800 600 100 L 50 50 0 0 I +X PA08 F4 800 500 100 L 50 50 0 0 I +X PA09 F5 800 400 100 L 50 50 0 0 I +X PA13 F6 800 300 100 L 50 50 0 0 I +X PA16 F7 800 200 100 L 50 50 0 0 I +X PA14 F8 800 100 100 L 50 50 0 0 I +X RFO_LF G1 800 -100 100 L 50 50 0 0 I +X GND_RF G2 800 -200 100 L 50 50 0 0 I +X GND_RF G3 800 -300 100 L 50 50 0 0 I +X VDDI01 G4 800 -400 100 L 50 50 0 0 I +X GND_RF G5 800 -500 100 L 50 50 0 0 I +X GND_RF G6 800 -600 100 L 50 50 0 0 I +X GND_RF G7 800 -700 100 L 50 50 0 0 I +X PA15 G8 800 -800 100 L 50 50 0 0 I +X RFI_LF H1 800 -900 100 L 50 50 0 0 I +X VR_ANA H2 800 -1000 100 L 50 50 0 0 I +X VBAT_ANA H3 800 -1100 100 L 50 50 0 0 I +X VR_DIG H4 800 -1200 100 L 50 50 0 0 I +X GND_RF H5 800 -1300 100 L 50 50 0 0 I +X XTA H6 800 -1400 100 L 50 50 0 0 I +X XTB H7 800 -1500 100 L 50 50 0 0 I +X VBAT_DIG H8 800 -1600 100 L 50 50 0 0 I +ENDDRAW +ENDDEF +# +# ST25DV04K-JF +# +DEF ST25DV04K-JF U 0 40 Y Y 1 F N +F0 "U" -500 400 50 H V C CNN +F1 "ST25DV04K-JF" 300 -400 50 H V C CNN +F2 "Elabdev:SOIC-8_3.9x4.9mm_Pitch1.27mm" 0 -500 50 H I C CIN +F3 "https://www.st.com/en/nfc/st25dv04k.html" 0 -600 50 H I C CNN +ALIAS ST25DV16K-JF ST25DV64K-JF ST25DV16K-JFR6S3 ST25DV64K-JFR6S3 +DRAW +S -550 350 550 -350 0 1 10 f +X VEH 1 -700 -250 150 R 40 40 1 1 I +X AC0 2 -700 -150 150 R 40 40 1 1 P +X AC1 3 -700 -50 150 R 40 40 1 1 P +X VSS 4 700 -250 150 L 40 40 1 1 W +X SDA 5 -700 50 150 R 40 40 1 1 B +X SCL 6 -700 150 150 R 40 40 1 1 I +X GPO 7 -700 250 150 R 40 40 1 1 O +X VCC 8 700 250 150 L 40 40 1 1 W +ENDDRAW +ENDDEF +# +# STM32WLE5C +# +DEF STM32WLE5C U 0 40 Y Y 1 F N +F0 "U" -700 1800 50 H V L CNN +F1 "STM32WLE5C" 700 1800 50 H V R CNN +F2 "Package_DFN_QFN:QFN-48-1EP_7x7mm_P0.5mm_EP5.6x5.6mm" -50 0 50 V I C CIN +F3 "https://www.st.com/en/microcontrollers-microprocessors/stm32wle5jc.html" 50 0 50 V I C CNN +$FPLIST + QFN*7x7mm*P0.5mm*EP5.6x5.6mm* +$ENDFPLIST +DRAW +S -700 1700 700 -1700 0 1 10 f +X PB3 1 -800 1600 100 R 50 50 0 0 I +X PB4 2 -800 1500 100 R 50 50 0 0 W +X PB5 3 -800 1400 100 R 50 50 0 0 I +X PB6 4 -800 1300 100 R 50 50 0 0 I +X PB7 5 -800 1200 100 R 50 50 0 0 I +X PB8 6 -800 1100 100 R 50 50 0 0 I +X PA0 7 -800 1000 100 R 50 50 0 0 I +X PA1 8 -800 900 100 R 50 50 0 0 I +X PA2 9 -800 800 100 R 50 50 0 0 I +X PA3 10 -800 700 100 R 50 50 0 0 I +X VDD 11 -800 600 100 R 50 50 0 0 I +X PA4 12 -800 500 100 R 50 50 0 0 I +X PA5 13 -800 400 100 R 50 50 0 0 I +X PA6 14 -800 300 100 R 50 50 0 0 I +X PA7 15 -800 200 100 R 50 50 0 0 I +X PA8 16 -800 100 100 R 50 50 0 0 I +X PA9 17 -800 -100 100 R 50 50 0 0 I +X NRST 18 -800 -200 100 R 50 50 0 0 I +X PH3-BOOT0 19 -800 -300 100 R 50 50 0 0 I +X RFI_P 20 -800 -400 100 R 50 50 0 0 I +X RFI_N 21 -800 -500 100 R 50 50 0 0 I +X RFO_LP 22 -800 -600 100 R 50 50 0 0 I +X RFO_HP 23 -800 -700 100 R 50 50 0 0 I +X VR_PA 24 -800 -800 100 R 50 50 0 0 I +X VDD_PA 25 -800 -900 100 R 50 50 0 0 I +X OSC_IN 26 -800 -1000 100 R 50 50 0 0 I +X OSC_OUT 27 -800 -1100 100 R 50 50 0 0 I +X VDDRF 28 -800 -1200 100 R 50 50 0 0 I +X VDDRF1V55 29 -800 -1300 100 R 50 50 0 0 I +X PB0-VDD_TCXO 30 -800 -1400 100 R 50 50 0 0 I +X PB2 31 -800 -1500 100 R 50 50 0 0 I +X PB12 32 -800 -1600 100 R 50 50 0 0 I +X PA10 33 800 1600 100 L 50 50 0 0 I +X PA11 34 800 1500 100 L 50 50 0 0 I +X PA12 35 800 1400 100 L 50 50 0 0 I +X PA13 36 800 1300 100 L 50 50 0 0 I +X VBAT 37 800 1200 100 L 50 50 0 0 I +X PC13 38 800 1100 100 L 50 50 0 0 I +X PC14_OSC32_IN 39 800 1000 100 L 50 50 0 0 I +X PC15_OSC32_OUT 40 800 900 100 L 50 50 0 0 I +X VDDA 41 800 800 100 L 50 50 0 0 I +X PA14 42 800 700 100 L 50 50 0 0 I +X PA15 43 800 600 100 L 50 50 0 0 I +X VDD 44 800 500 100 L 50 50 0 0 I +X VFBSMPS 45 800 400 100 L 50 50 0 0 I +X VDDSMPS 46 800 300 100 L 50 50 0 0 I +X VLXSMPS 47 800 200 100 L 50 50 0 0 I +X VSSSMPS 48 800 100 100 L 50 50 0 0 I +ENDDRAW +ENDDEF +# +# Soldfeld +# +DEF Soldfeld SF 0 40 Y Y 1 F N +F0 "SF" 0 50 50 H V C CNN +F1 "Soldfeld" 0 -50 50 H V C CNN +F2 "Elabdev:Solderarea" 0 -200 50 H I C CNN +F3 "" 0 0 50 H I C CNN +DRAW +S -200 -150 -200 150 0 1 0 N +S -200 150 200 150 0 1 0 N +S 200 -150 -200 -150 0 1 0 N +S 200 150 200 -150 0 1 0 N +ENDDRAW +ENDDEF +# +# USBCHole +# +DEF USBCHole HL 0 40 Y Y 1 F N +F0 "HL" 200 150 50 H V C CNN +F1 "USBCHole" 0 0 50 H V C CNN +F2 "Elabdev:USBTypecHole" 0 -150 50 H I C CNN +F3 "" 0 0 50 H I C CNN +DRAW +S -250 100 250 -100 0 1 0 N +ENDDRAW +ENDDEF +# +#End Library diff --git a/hardware/modules/elabdev.pretty/TFBGA-64_8x8_6.0x6.0mm_P0.65mm.kicad_mod b/hardware/modules/elabdev.pretty/TFBGA-64_8x8_6.0x6.0mm_P0.65mm.kicad_mod new file mode 100644 index 0000000..39eae4c --- /dev/null +++ b/hardware/modules/elabdev.pretty/TFBGA-64_8x8_6.0x6.0mm_P0.65mm.kicad_mod @@ -0,0 +1,101 @@ +(module Elabdev:TFBGA-64_8x8_6.0x6.0mm_P0.65mm (layer F.Cu) (tedit 5F4B02FE) + (attr smd) + (fp_text reference U** (at 0 -4) (layer F.SilkS) + (effects (font (size 1 1) (thickness 0.15))) + ) + (fp_text value TFBGA-64_8x8_6.0x6.0mm_P0.65mm (at 0 4) (layer F.Fab) + (effects (font (size 1 1) (thickness 0.15))) + ) + (fp_line (start -2 -3) (end -3 -2) (layer F.Fab) (width 0.1)) + (fp_line (start -3 -2) (end -3 3) (layer F.Fab) (width 0.1)) + (fp_line (start -3 3) (end 3 3) (layer F.Fab) (width 0.1)) + (fp_line (start 3 3) (end 3 -3) (layer F.Fab) (width 0.1)) + (fp_line (start 3 -3) (end -2 -3) (layer F.Fab) (width 0.1)) + (fp_line (start 1.62 -3.12) (end 3.12 -3.12) (layer F.SilkS) (width 0.12)) + (fp_line (start 3.12 -3.12) (end 3.12 -1.62) (layer F.SilkS) (width 0.12)) + (fp_line (start 1.62 -3.12) (end 3.12 -3.12) (layer F.SilkS) (width 0.12)) + (fp_line (start 3.12 -3.12) (end 3.12 -1.62) (layer F.SilkS) (width 0.12)) + (fp_line (start 1.62 3.12) (end 3.12 3.12) (layer F.SilkS) (width 0.12)) + (fp_line (start 3.12 3.12) (end 3.12 1.62) (layer F.SilkS) (width 0.12)) + (fp_line (start 1.62 -3.12) (end 3.12 -3.12) (layer F.SilkS) (width 0.12)) + (fp_line (start 3.12 -3.12) (end 3.12 -1.62) (layer F.SilkS) (width 0.12)) + (fp_line (start -1.62 3.12) (end -3.12 3.12) (layer F.SilkS) (width 0.12)) + (fp_line (start -3.12 3.12) (end -3.12 1.62) (layer F.SilkS) (width 0.12)) + (fp_line (start -1.62 -3.12) (end -2 -3.12) (layer F.SilkS) (width 0.12)) + (fp_line (start -2 -3.12) (end -3.12 -2) (layer F.SilkS) (width 0.12)) + (fp_line (start -3.12 -2) (end -3.12 -1.62) (layer F.SilkS) (width 0.12)) + (fp_circle (center -3 -3) (end -3 -2.9) (layer F.SilkS) (width 0.2)) + (fp_line (start -4 -4) (end 4 -4) (layer F.CrtYd) (width 0.05)) + (fp_line (start 4 -4) (end 4 4) (layer F.CrtYd) (width 0.05)) + (fp_line (start 4 4) (end -4 4) (layer F.CrtYd) (width 0.05)) + (fp_line (start -4 4) (end -4 -4) (layer F.CrtYd) (width 0.05)) + (pad A1 smd circle (at -2.275 -2.275) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad B1 smd circle (at -2.275 -1.625) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad C1 smd circle (at -2.275 -0.975) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad D1 smd circle (at -2.275 -0.325) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad E1 smd circle (at -2.275 0.325) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad F1 smd circle (at -2.275 0.975) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad G1 smd circle (at -2.275 1.625) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad H1 smd circle (at -2.275 2.275) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad A2 smd circle (at -1.625 -2.275) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad B2 smd circle (at -1.625 -1.625) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad C2 smd circle (at -1.625 -0.975) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad D2 smd circle (at -1.625 -0.325) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad E2 smd circle (at -1.625 0.325) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad F2 smd circle (at -1.625 0.975) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad G2 smd circle (at -1.625 1.625) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad H2 smd circle (at -1.625 2.275) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad A3 smd circle (at -0.975 -2.275) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad B3 smd circle (at -0.975 -1.625) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad C3 smd circle (at -0.975 -0.975) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad D3 smd circle (at -0.975 -0.325) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad E3 smd circle (at -0.975 0.325) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad F3 smd circle (at -0.975 0.975) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad G3 smd circle (at -0.975 1.625) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad H3 smd circle (at -0.975 2.275) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad A4 smd circle (at -0.325 -2.275) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad B4 smd circle (at -0.325 -1.625) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad C4 smd circle (at -0.325 -0.975) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad D4 smd circle (at -0.325 -0.325) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad E4 smd circle (at -0.325 0.325) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad F4 smd circle (at -0.325 0.975) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad G4 smd circle (at -0.325 1.625) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad H4 smd circle (at -0.325 2.275) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad A5 smd circle (at 0.325 -2.275) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad B5 smd circle (at 0.325 -1.625) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad C5 smd circle (at 0.325 -0.975) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad D5 smd circle (at 0.325 -0.325) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad E5 smd circle (at 0.325 0.325) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad F5 smd circle (at 0.325 0.975) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad G5 smd circle (at 0.325 1.625) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad H5 smd circle (at 0.325 2.275) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad A6 smd circle (at 0.975 -2.275) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad B6 smd circle (at 0.975 -1.625) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad C6 smd circle (at 0.975 -0.975) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad D6 smd circle (at 0.975 -0.325) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad E6 smd circle (at 0.975 0.325) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad F6 smd circle (at 0.975 0.975) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad G6 smd circle (at 0.975 1.625) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad H6 smd circle (at 0.975 2.275) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad A7 smd circle (at 1.625 -2.275) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad B7 smd circle (at 1.625 -1.625) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad C7 smd circle (at 1.625 -0.975) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad D7 smd circle (at 1.625 -0.325) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad E7 smd circle (at 1.625 0.325) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad F7 smd circle (at 1.625 0.975) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad G7 smd circle (at 1.625 1.625) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad H7 smd circle (at 1.625 2.275) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad A8 smd circle (at 2.275 -2.275) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad B8 smd circle (at 2.275 -1.625) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad C8 smd circle (at 2.275 -0.975) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad D8 smd circle (at 2.275 -0.325) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad E8 smd circle (at 2.275 0.325) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad F8 smd circle (at 2.275 0.975) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad G8 smd circle (at 2.275 1.625) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (pad H8 smd circle (at 2.275 2.275) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)) + (model ${KISYS3DMOD}/Package_BGA.3dshapes/TFBGA-64_5x5mm_Layout8x8_P0.5mm.wrl + (at (xyz 0 0 0)) + (scale (xyz 1.2 1.2 1.2)) + (rotate (xyz 0 0 0)) + ) +)