Include more project boilerplate structure and library cache.

hardware/dscomm-cache.lib

@@ -0,0 +1,4 @@
+EESchema-LIBRARY Version 2.4
+#encoding utf-8
+#
+#End Library

hardware/dscomm.kicad_pcb

@@ -1 +1,115 @@
-(kicad_pcb (version 4) (host kicad "dummy file") )
+(kicad_pcb (version 20171130) (host pcbnew 5.1.5+dfsg1-2build2)
+
+  (general
+    (thickness 1.6)
+    (drawings 0)
+    (tracks 0)
+    (zones 0)
+    (modules 0)
+    (nets 1)
+  )
+
+  (page A4)
+  (title_block
+    (title Democratic Sendcomm)
+    (date 2020-08-30)
+    (rev 0.8.0)
+    (company "Europalab Devices")
+    (comment 1 "Copyright © 2020, Europalab Devices")
+    (comment 2 "Fulfilling requirements of 201708018")
+    (comment 3 "Pending quality assurance testing")
+    (comment 4 "Release revision for manufacturing")
+  )
+
+  (layers
+    (0 F.Cu signal)
+    (31 B.Cu signal)
+    (32 B.Adhes user)
+    (33 F.Adhes user)
+    (34 B.Paste user)
+    (35 F.Paste user)
+    (36 B.SilkS user)
+    (37 F.SilkS user)
+    (38 B.Mask user)
+    (39 F.Mask user)
+    (40 Dwgs.User user)
+    (41 Cmts.User user)
+    (42 Eco1.User user)
+    (43 Eco2.User user)
+    (44 Edge.Cuts user)
+    (45 Margin user)
+    (46 B.CrtYd user)
+    (47 F.CrtYd user)
+    (48 B.Fab user)
+    (49 F.Fab user)
+  )
+
+  (setup
+    (last_trace_width 0.25)
+    (trace_clearance 0.2)
+    (zone_clearance 0.508)
+    (zone_45_only no)
+    (trace_min 0.2)
+    (via_size 0.8)
+    (via_drill 0.4)
+    (via_min_size 0.4)
+    (via_min_drill 0.3)
+    (uvia_size 0.3)
+    (uvia_drill 0.1)
+    (uvias_allowed no)
+    (uvia_min_size 0.2)
+    (uvia_min_drill 0.1)
+    (edge_width 0.05)
+    (segment_width 0.2)
+    (pcb_text_width 0.3)
+    (pcb_text_size 1.5 1.5)
+    (mod_edge_width 0.12)
+    (mod_text_size 1 1)
+    (mod_text_width 0.15)
+    (pad_size 1.524 1.524)
+    (pad_drill 0.762)
+    (pad_to_mask_clearance 0.051)
+    (solder_mask_min_width 0.25)
+    (aux_axis_origin 0 0)
+    (visible_elements FFFFFF7F)
+    (pcbplotparams
+      (layerselection 0x010fc_ffffffff)
+      (usegerberextensions false)
+      (usegerberattributes false)
+      (usegerberadvancedattributes false)
+      (creategerberjobfile false)
+      (excludeedgelayer true)
+      (linewidth 0.100000)
+      (plotframeref false)
+      (viasonmask false)
+      (mode 1)
+      (useauxorigin false)
+      (hpglpennumber 1)
+      (hpglpenspeed 20)
+      (hpglpendiameter 15.000000)
+      (psnegative false)
+      (psa4output false)
+      (plotreference true)
+      (plotvalue true)
+      (plotinvisibletext false)
+      (padsonsilk false)
+      (subtractmaskfromsilk false)
+      (outputformat 1)
+      (mirror false)
+      (drillshape 1)
+      (scaleselection 1)
+      (outputdirectory ""))
+  )
+
+  (net 0 "")
+
+  (net_class Default "Dies ist die voreingestellte Netzklasse."
+    (clearance 0.2)
+    (trace_width 0.25)
+    (via_dia 0.8)
+    (via_drill 0.4)
+    (uvia_dia 0.3)
+    (uvia_drill 0.1)
+  )
+
+)

hardware/dscomm.pro

@@ -1,29 +1,10 @@
-update=22/05/2015 07:44:53
+update=So 30 Aug 2020 20:35:03 CEST
 version=1
 last_client=kicad
 [general]
 version=1
 RootSch=
 BoardNm=
-[pcbnew]
-version=1
-LastNetListRead=
-UseCmpFile=1
-PadDrill=0.600000000000
-PadDrillOvalY=0.600000000000
-PadSizeH=1.500000000000
-PadSizeV=1.500000000000
-PcbTextSizeV=1.500000000000
-PcbTextSizeH=1.500000000000
-PcbTextThickness=0.300000000000
-ModuleTextSizeV=1.000000000000
-ModuleTextSizeH=1.000000000000
-ModuleTextSizeThickness=0.150000000000
-SolderMaskClearance=0.000000000000
-SolderMaskMinWidth=0.000000000000
-DrawSegmentWidth=0.200000000000
-BoardOutlineThickness=0.100000000000
-ModuleOutlineThickness=0.150000000000
 [cvpcb]
 version=1
 NetIExt=net
@@ -31,3 +12,237 @@ NetIExt=net
 version=1
 LibDir=
 [eeschema/libraries]
+[schematic_editor]
+version=1
+PageLayoutDescrFile=elabdev-white.kicad_wks
+PlotDirectoryName=
+SubpartIdSeparator=0
+SubpartFirstId=65
+NetFmtName=
+SpiceAjustPassiveValues=0
+LabSize=50
+ERC_TestSimilarLabels=1
+[pcbnew]
+version=1
+PageLayoutDescrFile=elabdev-black.kicad_wks
+LastNetListRead=
+CopperLayerCount=2
+BoardThickness=1.6
+AllowMicroVias=0
+AllowBlindVias=0
+RequireCourtyardDefinitions=0
+ProhibitOverlappingCourtyards=1
+MinTrackWidth=0.2
+MinViaDiameter=0.4
+MinViaDrill=0.3
+MinMicroViaDiameter=0.2
+MinMicroViaDrill=0.09999999999999999
+MinHoleToHole=0.25
+TrackWidth1=0.25
+ViaDiameter1=0.8
+ViaDrill1=0.4
+dPairWidth1=0.2
+dPairGap1=0.25
+dPairViaGap1=0.25
+SilkLineWidth=0.12
+SilkTextSizeV=1
+SilkTextSizeH=1
+SilkTextSizeThickness=0.15
+SilkTextItalic=0
+SilkTextUpright=1
+CopperLineWidth=0.2
+CopperTextSizeV=1.5
+CopperTextSizeH=1.5
+CopperTextThickness=0.3
+CopperTextItalic=0
+CopperTextUpright=1
+EdgeCutLineWidth=0.05
+CourtyardLineWidth=0.05
+OthersLineWidth=0.15
+OthersTextSizeV=1
+OthersTextSizeH=1
+OthersTextSizeThickness=0.15
+OthersTextItalic=0
+OthersTextUpright=1
+SolderMaskClearance=0.051
+SolderMaskMinWidth=0.25
+SolderPasteClearance=0
+SolderPasteRatio=0
+[pcbnew/Layer.F.Cu]
+Name=F.Cu
+Type=0
+Enabled=1
+[pcbnew/Layer.In1.Cu]
+Name=In1.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In2.Cu]
+Name=In2.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In3.Cu]
+Name=In3.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In4.Cu]
+Name=In4.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In5.Cu]
+Name=In5.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In6.Cu]
+Name=In6.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In7.Cu]
+Name=In7.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In8.Cu]
+Name=In8.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In9.Cu]
+Name=In9.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In10.Cu]
+Name=In10.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In11.Cu]
+Name=In11.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In12.Cu]
+Name=In12.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In13.Cu]
+Name=In13.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In14.Cu]
+Name=In14.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In15.Cu]
+Name=In15.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In16.Cu]
+Name=In16.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In17.Cu]
+Name=In17.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In18.Cu]
+Name=In18.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In19.Cu]
+Name=In19.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In20.Cu]
+Name=In20.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In21.Cu]
+Name=In21.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In22.Cu]
+Name=In22.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In23.Cu]
+Name=In23.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In24.Cu]
+Name=In24.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In25.Cu]
+Name=In25.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In26.Cu]
+Name=In26.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In27.Cu]
+Name=In27.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In28.Cu]
+Name=In28.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In29.Cu]
+Name=In29.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In30.Cu]
+Name=In30.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.B.Cu]
+Name=B.Cu
+Type=0
+Enabled=1
+[pcbnew/Layer.B.Adhes]
+Enabled=1
+[pcbnew/Layer.F.Adhes]
+Enabled=1
+[pcbnew/Layer.B.Paste]
+Enabled=1
+[pcbnew/Layer.F.Paste]
+Enabled=1
+[pcbnew/Layer.B.SilkS]
+Enabled=1
+[pcbnew/Layer.F.SilkS]
+Enabled=1
+[pcbnew/Layer.B.Mask]
+Enabled=1
+[pcbnew/Layer.F.Mask]
+Enabled=1
+[pcbnew/Layer.Dwgs.User]
+Enabled=1
+[pcbnew/Layer.Cmts.User]
+Enabled=1
+[pcbnew/Layer.Eco1.User]
+Enabled=1
+[pcbnew/Layer.Eco2.User]
+Enabled=1
+[pcbnew/Layer.Edge.Cuts]
+Enabled=1
+[pcbnew/Layer.Margin]
+Enabled=1
+[pcbnew/Layer.B.CrtYd]
+Enabled=1
+[pcbnew/Layer.F.CrtYd]
+Enabled=1
+[pcbnew/Layer.B.Fab]
+Enabled=1
+[pcbnew/Layer.F.Fab]
+Enabled=1
+[pcbnew/Layer.Rescue]
+Enabled=1
+[pcbnew/Netclasses]
+[pcbnew/Netclasses/Default]
+Name=Default
+Clearance=0.2
+TrackWidth=0.25
+ViaDiameter=0.8
+ViaDrill=0.4
+uViaDiameter=0.3
+uViaDrill=0.1
+dPairWidth=0.2
+dPairGap=0.25
+dPairViaGap=0.25

hardware/dscomm.sch

@@ -1,4 +1,16 @@
-EESchema Schematic File Version 2
-EELAYER 25 0
+EESchema Schematic File Version 4
+EELAYER 30 0
 EELAYER END
+$Descr A4 11693 8268
+encoding utf-8
+Sheet 1 1
+Title "Democratic Sendcomm"
+Date "2020-08-30"
+Rev "0.8.0"
+Comp "Europalab Devices"
+Comment1 "Copyright © 2020, Europalab Devices"
+Comment2 "Fulfilling requirements of 20200210"
+Comment3 "Pending quality assurance testing"
+Comment4 "Release revision for manufacturing"
+$EndDescr
 $EndSCHEMATC