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Releases

  • Stable REL_2 af5147cf78

    Sendcomm-0.9.4

    michael 3 years ago 34 commits to master since this release

    Description

    This release marks improvement of design work on Microchip SAMR34 architecture hardware circuits and firmware samples.

    Assets

    Files terminating with .bin in the firmware archive are Cortex-M0+ binaries to program the SAMR34 chip using a SWD capable debugging device on connectors J4 and J20.

    Tickets

    Num Description
    #175 The parts list lacks antenna recommendations
    #174 P2P application fails to print to serial console
    #172 Integrate Qwiic and Stemma
    #167 EEPROM device tree lacks the reset GPIO
    #165 Chip antenna AE5 position is not 50Ω impedance
    #164 List of unique parts contains too many parts
    #163 The alternate TCXO design lacks a EN signal
    #162 The D2 diode is too close to a corner hole
    #161 Hinge cutout position and size are wrong
    #160 Conflicting GCLK0 is used for LSE tests
    #159 D1 and D2 resistance levels are not balanced
    #158 The diode at D8 is uncomfortably bright
    #157 Designators are not axis aligned
    #155 C96 lacks an alternate TCX0 notation
    #154 Panel mounts are the wrong diameter
    #153 The host is unable to reset the chip
    #146 JTAG connection is incomplete
    #145 Fiducials cause automation failure
    #141 S11 measurements are missing
    #138 EEPROM header J7 may be unnecessary
    #137 Incompatability with A and B boards
    #136 EEPROM is delivered in empty state
    #135 Use of GCLK_0 for LSE output is flawed
    #131 Copper pours exclude areas improperly
    #123 Test HSE crystal circuit for best practice
    #121 Test LSE crystal circuit for best practice
    #79 Resolve LED intensity consistency
    #68 Allow flash programming over UART
    #67 Obtain parts for production devices
    #63 Consider lack of frequency adoption
    #59 Optimise bypass capacitances
    #55 Optimise the radio switch circuit
    #47 Integrate Click sensors
    #46 Integrate PMOD sensors
    #44 Measure S11/S21 parameters
    #39 Indicate parts placements
    #38 Obtain sample parts
    #37 Do virtual visits to stakeholders
    #36 Discuss tolerances with fabricators
    #31 RF layers lack via stiching
    #30 Reduce copper layers
    #25 Structure EPROM Data
    #24 STM delivery conditions unmet
    #16 Resolve lack of SDK resources
    #9 Test several antennas

    Downloads

     
  • Stable REL_1 7927ab7047

    Sendcomm-0.9.2

    michael 3 years ago 123 commits to master since this release

    Description

    This release marks conclusion of design work on Microchip SAMR34 architecture hardware circuits and firmware samples.

    Assets

    Files terminating with .bin in the firmware archive are Cortex-M0+ binaries to program the SAMR34 chip using a SWD capable debugging device on connectors J4 and J20.

    Tickets

    Num Description
    #128 USB bus power destroys MCU PA07
    #127 A clock rerouted pin is not broken out
    #126 BGA footprint lacks alignment markings
    #122 SMA connector is secondary and unneeded
    #118 Capacitor C18-19 values are wrong
    #114 C30 is placed 27pF instead of 2,7pF
    #112 Samples lack Microchip reference
    #111 Documentation lacks a P2P sample
    #109 RTC in MLS fails when PMM is enabled
    #107 UART lines lack pullup resistors
    #105 Solder chemistry is wrong for BGA
    #104 AE5 pad 1 has unconnected vias
    #97 The paste layer lacks a ground pad
    #96 The panel design lacks a frame template
    #94 Integrate Grove sensors enhancement
    #93 The LDO at U2 is the wrong footprint
    #92 Silkscreen designators are not fixed bug
    #91 Test FB1 with MH2029-601Y alternative
    #89 Design lacks a standard JTAG connector
    #88 Jumper between C22 and PA9 is missing
    #85 Apply the catchall diagnosis step
    #84 Solve UART encoding corruption
    #83 Ensure power detour matches MLS
    #82 Replace oscillator with a suitable crystal
    #81 L1 is not clearly marked DNF
    #80 A 1μF capacitor is missing near VDDCORE
    #78 Replace yellow D2 with red colour
    #76 Replace solderjumpers with oval shapes
    #75 Modify header pins to solder jumpers
    #74 Traces to JP2 and JP3 are wrong bug
    #73 Replace XC1 with inexpensive option
    #72 Route TP3 and TP4 to I²C bus
    #71 Change FB1 from 0402 to 0805
    #70 JP7 and JP9 are optically reversed
    #65 Verify most current reference circuits
    #62 Request a wireless design review
    #61 Request a MCU design review
    #43 Test several tactile switches
    #37 Do virtual visits to stakeholders
    #35 Add a board to board connector
    #34 Switch antennas mechanically
    #33 Align panel to Stencil8
    #32 Include missing footprints
    #29 Reduce part layers
    #21 Publish a bill of materials
    #17 Test documentation is lacking
    #15 Complete a draft design
    #14 Add missing footprints
    #13 Add missing symbols
    #12 Clarify ATSAMR34 power circuits
    #11 Document collection is missing
    #10 Progress information is lacking
    #8 Design for daughterboards
    #6 Segregate ground planes
    #4 Refactor schematic blocks

    Downloads

     
  • 3 years ago

    DCHK_1

    8c6be81782 ZIP TAR.GZ
     
  • 3 years ago

    PRE_2

    bb8473ae5a ZIP TAR.GZ
     
  • 3 years ago

    PRE_1

    44bdd2e1e4 ZIP TAR.GZ