Sürümler

  • Sendcomm-0.9.4

    michael 3 yıl önce %!s(int64=34) son sürümden beri %!d(string=master) işleme

    Description

    This release marks improvement of design work on Microchip SAMR34 architecture hardware circuits and firmware samples.

    Assets

    Files terminating with .bin in the firmware archive are Cortex-M0+ binaries to program the SAMR34 chip using a SWD capable debugging device on connectors J4 and J20.


    Tickets

    Num Description
    #175 The parts list lacks antenna recommendations
    #174 P2P application fails to print to serial console
    #172 Integrate Qwiic and Stemma
    #167 EEPROM device tree lacks the reset GPIO
    #165 Chip antenna AE5 position is not 50Ω impedance
    #164 List of unique parts contains too many parts
    #163 The alternate TCXO design lacks a EN signal
    #162 The D2 diode is too close to a corner hole
    #161 Hinge cutout position and size are wrong
    #160 Conflicting GCLK0 is used for LSE tests
    #159 D1 and D2 resistance levels are not balanced
    #158 The diode at D8 is uncomfortably bright
    #157 Designators are not axis aligned
    #155 C96 lacks an alternate TCX0 notation
    #154 Panel mounts are the wrong diameter
    #153 The host is unable to reset the chip
    #146 JTAG connection is incomplete
    #145 Fiducials cause automation failure
    #141 S11 measurements are missing
    #138 EEPROM header J7 may be unnecessary
    #137 Incompatability with A and B boards
    #136 EEPROM is delivered in empty state
    #135 Use of GCLK_0 for LSE output is flawed
    #131 Copper pours exclude areas improperly
    #123 Test HSE crystal circuit for best practice
    #121 Test LSE crystal circuit for best practice
    #79 Resolve LED intensity consistency
    #68 Allow flash programming over UART
    #67 Obtain parts for production devices
    #63 Consider lack of frequency adoption
    #59 Optimise bypass capacitances
    #55 Optimise the radio switch circuit
    #47 Integrate Click sensors
    #46 Integrate PMOD sensors
    #44 Measure S11/S21 parameters
    #39 Indicate parts placements
    #38 Obtain sample parts
    #37 Do virtual visits to stakeholders
    #36 Discuss tolerances with fabricators
    #31 RF layers lack via stiching
    #30 Reduce copper layers
    #25 Structure EPROM Data
    #24 STM delivery conditions unmet
    #16 Resolve lack of SDK resources
    #9 Test several antennas
     
  • Sendcomm-0.9.2

    michael 3 yıl önce %!s(int64=123) son sürümden beri %!d(string=master) işleme

    Description

    This release marks conclusion of design work on Microchip SAMR34 architecture hardware circuits and firmware samples.

    Assets

    Files terminating with .bin in the firmware archive are Cortex-M0+ binaries to program the SAMR34 chip using a SWD capable debugging device on connectors J4 and J20.


    Tickets

    Num Description
    #128 USB bus power destroys MCU PA07
    #127 A clock rerouted pin is not broken out
    #126 BGA footprint lacks alignment markings
    #122 SMA connector is secondary and unneeded
    #118 Capacitor C18-19 values are wrong
    #114 C30 is placed 27pF instead of 2,7pF
    #112 Samples lack Microchip reference
    #111 Documentation lacks a P2P sample
    #109 RTC in MLS fails when PMM is enabled
    #107 UART lines lack pullup resistors
    #105 Solder chemistry is wrong for BGA
    #104 AE5 pad 1 has unconnected vias
    #97 The paste layer lacks a ground pad
    #96 The panel design lacks a frame template
    #94 Integrate Grove sensors enhancement
    #93 The LDO at U2 is the wrong footprint
    #92 Silkscreen designators are not fixed bug
    #91 Test FB1 with MH2029-601Y alternative
    #89 Design lacks a standard JTAG connector
    #88 Jumper between C22 and PA9 is missing
    #85 Apply the catchall diagnosis step
    #84 Solve UART encoding corruption
    #83 Ensure power detour matches MLS
    #82 Replace oscillator with a suitable crystal
    #81 L1 is not clearly marked DNF
    #80 A 1μF capacitor is missing near VDDCORE
    #78 Replace yellow D2 with red colour
    #76 Replace solderjumpers with oval shapes
    #75 Modify header pins to solder jumpers
    #74 Traces to JP2 and JP3 are wrong bug
    #73 Replace XC1 with inexpensive option
    #72 Route TP3 and TP4 to I²C bus
    #71 Change FB1 from 0402 to 0805
    #70 JP7 and JP9 are optically reversed
    #65 Verify most current reference circuits
    #62 Request a wireless design review
    #61 Request a MCU design review
    #43 Test several tactile switches
    #37 Do virtual visits to stakeholders
    #35 Add a board to board connector
    #34 Switch antennas mechanically
    #33 Align panel to Stencil8
    #32 Include missing footprints
    #29 Reduce part layers
    #21 Publish a bill of materials
    #17 Test documentation is lacking
    #15 Complete a draft design
    #14 Add missing footprints
    #13 Add missing symbols
    #12 Clarify ATSAMR34 power circuits
    #11 Document collection is missing
    #10 Progress information is lacking
    #8 Design for daughterboards
    #6 Segregate ground planes
    #4 Refactor schematic blocks
     
  • 3 yıl önce
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  • 3 yıl önce