4 yıl önce %!s(int64=34) son sürümden beri %!d(string=master) işleme
This release marks improvement of design work on Microchip SAMR34 architecture hardware circuits and firmware samples.
Files terminating with .bin in the firmware archive are Cortex-M0+ binaries to program the SAMR34 chip using a SWD capable debugging device on connectors J4 and J20.
Num | Description |
---|---|
#175 | The parts list lacks antenna recommendations |
#174 | P2P application fails to print to serial console |
#172 | Integrate Qwiic and Stemma |
#167 | EEPROM device tree lacks the reset GPIO |
#165 | Chip antenna AE5 position is not 50Ω impedance |
#164 | List of unique parts contains too many parts |
#163 | The alternate TCXO design lacks a EN signal |
#162 | The D2 diode is too close to a corner hole |
#161 | Hinge cutout position and size are wrong |
#160 | Conflicting GCLK0 is used for LSE tests |
#159 | D1 and D2 resistance levels are not balanced |
#158 | The diode at D8 is uncomfortably bright |
#157 | Designators are not axis aligned |
#155 | C96 lacks an alternate TCX0 notation |
#154 | Panel mounts are the wrong diameter |
#153 | The host is unable to reset the chip |
#146 | JTAG connection is incomplete |
#145 | Fiducials cause automation failure |
#141 | S11 measurements are missing |
#138 | EEPROM header J7 may be unnecessary |
#137 | Incompatability with A and B boards |
#136 | EEPROM is delivered in empty state |
#135 | Use of GCLK_0 for LSE output is flawed |
#131 | Copper pours exclude areas improperly |
#123 | Test HSE crystal circuit for best practice |
#121 | Test LSE crystal circuit for best practice |
#79 | Resolve LED intensity consistency |
#68 | Allow flash programming over UART |
#67 | Obtain parts for production devices |
#63 | Consider lack of frequency adoption |
#59 | Optimise bypass capacitances |
#55 | Optimise the radio switch circuit |
#47 | Integrate Click sensors |
#46 | Integrate PMOD sensors |
#44 | Measure S11/S21 parameters |
#39 | Indicate parts placements |
#38 | Obtain sample parts |
#37 | Do virtual visits to stakeholders |
#36 | Discuss tolerances with fabricators |
#31 | RF layers lack via stiching |
#30 | Reduce copper layers |
#25 | Structure EPROM Data |
#24 | STM delivery conditions unmet |
#16 | Resolve lack of SDK resources |
#9 | Test several antennas |
4 yıl önce %!s(int64=123) son sürümden beri %!d(string=master) işleme
This release marks conclusion of design work on Microchip SAMR34 architecture hardware circuits and firmware samples.
Files terminating with .bin in the firmware archive are Cortex-M0+ binaries to program the SAMR34 chip using a SWD capable debugging device on connectors J4 and J20.
Num | Description |
---|---|
#128 | USB bus power destroys MCU PA07 |
#127 | A clock rerouted pin is not broken out |
#126 | BGA footprint lacks alignment markings |
#122 | SMA connector is secondary and unneeded |
#118 | Capacitor C18-19 values are wrong |
#114 | C30 is placed 27pF instead of 2,7pF |
#112 | Samples lack Microchip reference |
#111 | Documentation lacks a P2P sample |
#109 | RTC in MLS fails when PMM is enabled |
#107 | UART lines lack pullup resistors |
#105 | Solder chemistry is wrong for BGA |
#104 | AE5 pad 1 has unconnected vias |
#97 | The paste layer lacks a ground pad |
#96 | The panel design lacks a frame template |
#94 | Integrate Grove sensors enhancement |
#93 | The LDO at U2 is the wrong footprint |
#92 | Silkscreen designators are not fixed bug |
#91 | Test FB1 with MH2029-601Y alternative |
#89 | Design lacks a standard JTAG connector |
#88 | Jumper between C22 and PA9 is missing |
#85 | Apply the catchall diagnosis step |
#84 | Solve UART encoding corruption |
#83 | Ensure power detour matches MLS |
#82 | Replace oscillator with a suitable crystal |
#81 | L1 is not clearly marked DNF |
#80 | A 1μF capacitor is missing near VDDCORE |
#78 | Replace yellow D2 with red colour |
#76 | Replace solderjumpers with oval shapes |
#75 | Modify header pins to solder jumpers |
#74 | Traces to JP2 and JP3 are wrong bug |
#73 | Replace XC1 with inexpensive option |
#72 | Route TP3 and TP4 to I²C bus |
#71 | Change FB1 from 0402 to 0805 |
#70 | JP7 and JP9 are optically reversed |
#65 | Verify most current reference circuits |
#62 | Request a wireless design review |
#61 | Request a MCU design review |
#43 | Test several tactile switches |
#37 | Do virtual visits to stakeholders |
#35 | Add a board to board connector |
#34 | Switch antennas mechanically |
#33 | Align panel to Stencil8 |
#32 | Include missing footprints |
#29 | Reduce part layers |
#21 | Publish a bill of materials |
#17 | Test documentation is lacking |
#15 | Complete a draft design |
#14 | Add missing footprints |
#13 | Add missing symbols |
#12 | Clarify ATSAMR34 power circuits |
#11 | Document collection is missing |
#10 | Progress information is lacking |
#8 | Design for daughterboards |
#6 | Segregate ground planes |
#4 | Refactor schematic blocks |