# The paste layer lacks a ground pad ## Problem environment The QFN-12 part designated U4 corresponds with a RF switch that includes a ground pad. To accommodate this footprint the project publishes a custom module. ## Steps to reproduce 1. Refer to the layout design 1. Examine the ground pad of U4 1. Refer to the X.274 archive paste layer 1. Compare the U4 lithography shape ## Expected result Both layout and manufacturing files indicate a ground pad in the U4 paste layer. ## Actual result The U4 module is flawed and only indicates a ground pad in the layout. ## Workaround Ask the steel foil fabrication service to manually open the U4 ground pad aperture. ## Severity level This is **medium priority** because the U4 RF switch is of high importance for proper runtime to correctly specify.

Resolved by 9a29ebf.