#97 The paste layer lacks a ground pad

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Michael Schloh von Bennewitz4年前に作成 · 1件のコメント

The paste layer lacks a ground pad

Problem environment

The QFN-12 part designated U4 corresponds with a RF switch that includes a ground pad. To accommodate this footprint the project publishes a custom module.

Steps to reproduce

  1. Refer to the layout design
  2. Examine the ground pad of U4
  3. Refer to the X.274 archive paste layer
  4. Compare the U4 lithography shape

Expected result

Both layout and manufacturing files indicate a ground pad in the U4 paste layer.

Actual result

The U4 module is flawed and only indicates a ground pad in the layout.

Workaround

Ask the steel foil fabrication service to manually open the U4 ground pad aperture.

Severity level

This is medium priority because the U4 RF switch is of high importance for proper runtime to correctly specify.

# The paste layer lacks a ground pad ## Problem environment The QFN-12 part designated U4 corresponds with a RF switch that includes a ground pad. To accommodate this footprint the project publishes a custom module. ## Steps to reproduce 1. Refer to the layout design 1. Examine the ground pad of U4 1. Refer to the X.274 archive paste layer 1. Compare the U4 lithography shape ## Expected result Both layout and manufacturing files indicate a ground pad in the U4 paste layer. ## Actual result The U4 module is flawed and only indicates a ground pad in the layout. ## Workaround Ask the steel foil fabrication service to manually open the U4 ground pad aperture. ## Severity level This is **medium priority** because the U4 RF switch is of high importance for proper runtime to correctly specify.
Michael Schloh von Bennewitz がラベル
bug
を追加 4年前
Michael Schloh von Bennewitz がマイルストーン Layout design に追加 4年前
Michael Schloh von Bennewitz4年前 にコメント
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Resolved by 9a29ebf.

Resolved by 9a29ebf.
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