Record a release engineering checklist for reasons of quality assurance.

testplan/releasecheck.txt

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+Release Engineering Checklist
+
+Do the following to create a new release, in 8-10 hours duration.
+
+Sources
+
+Update copyrights
+Update versions
+Update dates
+Strip frame, tabs, and save dscomm-tmpl.kicad_pcb
+Update dscomm-frame.kicad_pcb for integration
+Delete logic from dscomm-panel.kicad_pcb
+Append logic from dscomm-tmpl.kicad_pcb
+Rework copper pours, planes, and tabs
+Append dscomm-panel.kicad_pcb to dscomm-stencil.kicad_pcb
+Remove paste definitions selectively (from mount holes)
+
+Hard Copy
+
+Plot schematic to dscomm-sch.pdf
+Plot layout to fabsingle files
+Use gs(1) to combine files [1]
+Review dscomm-brd.pdf for pdfmarks
+Update the bill of materials FODS
+Use librewriter(1) for dscomm-bill.pdf
+Online PDF compression is not helpful
+
+[1] gs -dBATCH -dNOPAUSE -q -sDEVICE=pdfwrite -dAutoRotatePages=/None -sOutputFile=dscomm-brd.pdf dscomm-F_Cu.pdf dscomm-F_Fab.pdf dscomm-F_Mask.pdf dscomm-F_Paste.pdf dscomm-F_SilkS.pdf dscomm-In1_Cu.pdf dscomm-In2_Cu.pdf dscomm-B_Cu.pdf dscomm-B_Fab.pdf dscomm-B_Mask.pdf dscomm-B_Paste.pdf dscomm-B_SilkS.pdf dscomm-Cmts_User.pdf dscomm-Dwgs_User.pdf dscomm-Edge_Cuts.pdf dscomm-pdfmarks
+
+EEPROM
+
+Review programdat.txt for up to date accuracy
+Use eepmake(1) to generate a new database [2]
+
+[2] eepmake programdat.txt SendcommHat-dat.eep
+
+Firmware
+
+Review firmware changes
+Build solution binaries
+Collect with SendcommHat-dat.eep
+Package to DSCommFW-X.X.X.tar.xz
+DSCommFW-X.X.X/Debug/SendcommCmdsys-dbg.bin
+DSCommFW-X.X.X/Debug/SendcommPeer2P-dbg.bin
+DSCommFW-X.X.X/Debug/SendcommLWOTAA-dbg.bin
+DSCommFW-X.X.X/Debug/SendcommHellow-dbg.bin
+DSCommFW-X.X.X/Release/SendcommPeer2P-rel.bin
+DSCommFW-X.X.X/Release/SendcommCmdsys-rel.bin
+DSCommFW-X.X.X/Release/SendcommHellow-rel.bin
+DSCommFW-X.X.X/Release/SendcommLWOTAA-rel.bin
+
+Manufacturing
+
+Review the bill of materials for up to date accuracy
+Generate Excellon drills and Gerber layers for the panel *
+Generate Excellon drills and Gerber layers for the foil
+Set placement origin of layout to reflect 0,0 on corner
+Generate CSV placements for raw, import, and machine use
+Edit CSV placements to prepare for machine importing
+  Add a machine import header
+  Replace all 'top' with 'T'
+  Replace all commas with periods
+  Replace '270' with '-90' degrees
+  Replace all trailing '00' strings
+  Remove THT and most virtual parts
+  Round up and down four figure locations
+  sed(1) ' \([0-9][^\.][^\.\ ]*\.[0-9][0-9]\)00/ \1'
+  Review completeness replacements /\.[0-9][0-9][0-9]
+  Replace 'X_0805_2012Metric' with '0805'
+  Abbreviate as many columns as possible
+  Move fiducial marks to the bottom
+  Rearrange order of designators
+  Choose appropriate starting chip
+  Multiply axis positions three times **
+  Reorder columns according to machine **
+  Replace space characters with one comma **
+  ** sed(1) '^\([^\ ][^\ ]*\)\ \ *\([^\ ][^\ ]*\)\ \ *\([^\ ][^\ ]*\)\ \ *\([^\ ][^\ ]*\)\ \ *\([^\ ][^\ ]*\)\ \ *\([^\ ][^\ ]*\)\ \ *\([^\ ][^\ ]*\)$/\1,\3,\4,\5,\4,\5,\4,\5,\7,\6,\2'
+Compress * manufacturing archives to DSCommFab-X.X.X.tar.xz
+Compress foil stencil variant to DSCommStenc-X.X.X.tar.xz
+
+Last step verifications
+
+Before commiting tags and release, upload to board fabricator.
+Await clearance pending data preparation before continuing.
+
+Git Repository
+
+Edit the project change log 'CHANGELOG'
+Create and push the annotated tag [3][4]
+Click to release /dsendcomm/releases/new/
+Edit title /dsendcomm/releases/edit/REL_X/
+Edit 'Description and 'Assets' subtitles
+Edit 'Tickets' completed since last release
+
+[3] git tag -a REL_X -m 'Release to manufacturing before the new year holidays.'
+[4] git push origin REL_X