Add top layer test points to connect with bottom layer solder grid.

hardware/conn-mchip.sch

@@ -527,24 +527,20 @@ $EndComp
 $Comp
 L Connector_Generic:Conn_02x04_Top_Bottom J6
 U 1 1 5F9DDFF1
-P 3100 6150
-F 0 "J6" H 3150 6467 50  0000 C CNN
-F 1 "Conn_02x04_Top_Bottom" H 3150 6376 50  0000 C CNN
-F 2 "Elabdev:Millmax_Pogopin_2x4_P2.54mm" H 3100 6150 50  0001 C CNN
-F 3 "~" H 3100 6150 50  0001 C CNN
-	1    3100 6150
+P 3400 6150
+F 0 "J6" H 3450 6467 50  0000 C CNN
+F 1 "Conn_02x04_Top_Bottom" H 3450 6376 50  0000 C CNN
+F 2 "Elabdev:Millmax_Pogopin_2x4_P2.54mm" H 3400 6150 50  0001 C CNN
+F 3 "~" H 3400 6150 50  0001 C CNN
+	1    3400 6150
 	1    0    0    -1  
 $EndComp
 Text Notes 2950 5550 0    100  ~ 0
 POGO
-NoConn ~ 2900 6050
-NoConn ~ 2900 6150
-NoConn ~ 2900 6250
-NoConn ~ 2900 6350
-NoConn ~ 3400 6050
-NoConn ~ 3400 6150
-NoConn ~ 3400 6250
-NoConn ~ 3400 6350
+NoConn ~ 3700 6050
+NoConn ~ 3700 6150
+NoConn ~ 3700 6250
+NoConn ~ 3700 6350
 $Comp
 L Elabdev:Soldfeld SF1
 U 1 1 5FA04057
@@ -653,4 +649,72 @@ Wire Wire Line
 	7850 4150 7950 4150
 Wire Wire Line
 	7950 4150 7950 3950
+$Comp
+L Connector:TestPoint TP7
+U 1 1 5FCA66A8
+P 2800 5900
+F 0 "TP7" H 2750 6050 50  0000 R CNN
+F 1 "TestPoint" H 2750 5950 50  0000 R CNN
+F 2 "TestPoint:TestPoint_Pad_2.0x2.0mm" H 3000 5900 50  0001 C CNN
+F 3 "~" H 3000 5900 50  0001 C CNN
+	1    2800 5900
+	1    0    0    -1  
+$EndComp
+$Comp
+L Connector:TestPoint TP8
+U 1 1 5FCB3E54
+P 2800 6100
+F 0 "TP8" H 2750 6250 50  0000 R CNN
+F 1 "TestPoint" H 2750 6150 50  0000 R CNN
+F 2 "TestPoint:TestPoint_Pad_2.0x2.0mm" H 3000 6100 50  0001 C CNN
+F 3 "~" H 3000 6100 50  0001 C CNN
+	1    2800 6100
+	1    0    0    -1  
+$EndComp
+$Comp
+L Connector:TestPoint TP9
+U 1 1 5FCB3F22
+P 2800 6300
+F 0 "TP9" H 2750 6450 50  0000 R CNN
+F 1 "TestPoint" H 2750 6350 50  0000 R CNN
+F 2 "TestPoint:TestPoint_Pad_2.0x2.0mm" H 3000 6300 50  0001 C CNN
+F 3 "~" H 3000 6300 50  0001 C CNN
+	1    2800 6300
+	1    0    0    -1  
+$EndComp
+$Comp
+L Connector:TestPoint TP10
+U 1 1 5FCB3FF0
+P 2800 6500
+F 0 "TP10" H 2750 6650 50  0000 R CNN
+F 1 "TestPoint" H 2750 6550 50  0000 R CNN
+F 2 "TestPoint:TestPoint_Pad_2.0x2.0mm" H 3000 6500 50  0001 C CNN
+F 3 "~" H 3000 6500 50  0001 C CNN
+	1    2800 6500
+	1    0    0    -1  
+$EndComp
+Wire Wire Line
+	3200 6050 2900 6050
+Wire Wire Line
+	2900 6050 2900 5900
+Wire Wire Line
+	2900 5900 2800 5900
+Wire Wire Line
+	3200 6150 2900 6150
+Wire Wire Line
+	2900 6150 2900 6100
+Wire Wire Line
+	2900 6100 2800 6100
+Wire Wire Line
+	3200 6250 2900 6250
+Wire Wire Line
+	2900 6250 2900 6300
+Wire Wire Line
+	2900 6300 2800 6300
+Wire Wire Line
+	3200 6350 2900 6350
+Wire Wire Line
+	2900 6350 2900 6500
+Wire Wire Line
+	2900 6500 2800 6500
 $EndSCHEMATC