# Review release documents of STM design ## Problem environment The STM design dependencies have changed from prerelease to released status, before the Sendcomm design was fabricated. ## Steps to reproduce 1. Refer to the [ST online documentation](https://www.st.com/en/evaluation-tools/nucleo-wl55jc.html#documentation) 1. Review the **MB1389-WL55JC-highband-D04 Schematics** 1. Review the **MB1389 Bill of Materials** 1. Review the **MB1389 Manufacturing files** 1. Review the **MB1389 Board design project files** ## Expected result The current state of STM32WL release matches the Sendcomm design. ## Actual result It is unknown if the Sendcomm design integrates the most recent STM32WL developments. ## Resources https://www.st.com/resource/en/application_note/dm00690797-rf-matching-network-design-guide-for-stm32wl-series-stmicroelectronics.pdf https://www.st.com/resource/en/application_note/dm00660594-optimized-rf-board-layout-for-stm32wl-series-stmicroelectronics.pdf https://www.st.com/content/ccc/resource/technical/binary_resources/demos_resources/group0/66/c4/af/9d/20/21/48/7b/nucleo-wl55jc_demo/files/nucleo-wl55jc_demo.zip/jcr:content/translations/en.nucleo-wl55jc_demo.zip ## Severity level This is **low priority** because project requirements do not state derivative designs.