Four copper layers are used for layout design, although it's unlikely more than two are needed for a research device.
Steps to reproduce
Observe traces and areas on the middle layers
Compare copper needed with existing top and bottom areas
Expected result
The top and bottom layers cannot accommodate all circuits.
Actual result
The top and bottom layers have enough space to accommodate all circuits.
Workaround Note
It's likely to be easier to reduce copper layers after antenna and connector selection is final, because early designs include multiple redundant parts.
Severity level
This is medium priority because a two copper layer design reduction frees resources.
# Reduce copper layers
## Problem environment
Four copper layers are used for layout design, although it's unlikely more than two are needed for a research device.
## Steps to reproduce
1. Observe traces and areas on the middle layers
1. Compare copper needed with existing top and bottom areas
## Expected result
The top and bottom layers cannot accommodate all circuits.
## Actual result
The top and bottom layers have enough space to accommodate all circuits.
## Workaround Note
It's likely to be easier to reduce copper layers after antenna and connector selection is final, because early designs include multiple redundant parts.
## Severity level
This is **medium priority** because a two copper layer design reduction frees resources.
Reduce copper layers
Problem environment
Four copper layers are used for layout design, although it's unlikely more than two are needed for a research device.
Steps to reproduce
Expected result
The top and bottom layers cannot accommodate all circuits.
Actual result
The top and bottom layers have enough space to accommodate all circuits.
Workaround Note
It's likely to be easier to reduce copper layers after antenna and connector selection is final, because early designs include multiple redundant parts.
Severity level
This is medium priority because a two copper layer design reduction frees resources.
Being too invested in the BGA 0,5mm pitch design requires HDI and four copper layers.