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Europalab Devices produces a LoRaWAN transmitting client node, specialised for higher research of actuator and sensor assisted IoT networks. https://dev.europalab.com/nlnet/20200000/
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dsendcomm/hardware/modules/elabdev.pretty/Linx_ANT-868-SP_38x98mm.kic...

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  1. (module Elabdev:Linx_ANT-868-SP_38x98mm (layer F.Cu) (tedit 5F57B566)

  2.   (descr "868MHz Chip RF Antenna 1,1dBi Solder Surface Mount")

  3.   (tags "antenna lora subghz subgigaherz")

  4.   (attr smd)

  5.   (fp_text reference REF** (at 17 -50) (layer F.SilkS)

  6.     (effects (font (size 1 1) (thickness 0.15)))

  7.   )

  8.   (fp_text value Linx_ANT-868-SP_38x98mm (at -10 -50) (layer F.Fab)

  9.     (effects (font (size 1 1) (thickness 0.15)))

  10.   )

  11.   (fp_line (start -19.43 -49.275) (end -19.43 49.275) (layer F.SilkS) (width 0.15))

  12.   (fp_line (start -19.43 49.275) (end 19.43 49.275) (layer F.SilkS) (width 0.15))

  13.   (fp_line (start 19.43 49.275) (end 19.43 -49.275) (layer F.SilkS) (width 0.15))

  14.   (fp_line (start 19.43 -49.275) (end -19.43 -49.275) (layer F.SilkS) (width 0.15))

  15.   (fp_poly (pts (xy 18.925 48.77) (xy -18.925 48.77) (xy -18.925 -34.8) (xy 18.925 -34.8)) (layer B.Fab) (width 0.1))

  16.   (fp_text user "Counterpoise copper plane " (at 0 0) (layer Cmts.User)

  17.     (effects (font (size 1.5 1.5) (thickness 0.3)))

  18.   )

  19.   (fp_poly (pts (xy 13.97 -34.8) (xy -13.97 -34.8) (xy -13.97 -48.5) (xy 13.97 -48.5)) (layer F.Fab) (width 0.1))

  20.   (fp_text user "Antenna chip" (at 0 -42) (layer Cmts.User)

  21.     (effects (font (size 1.5 1.5) (thickness 0.3)))

  22.   )

  23.   (pad 1 smd rect (at -12.7 -34.8) (size 2.03 2.54) (layers F.Cu F.Paste F.Mask))

  24.   (pad 2 smd rect (at -7.62 -34.8) (size 2.03 2.54) (layers F.Cu F.Paste F.Mask))

  25.   (pad 2 smd rect (at -2.54 -34.8) (size 2.03 2.54) (layers F.Cu F.Paste F.Mask))

  26.   (pad 2 smd rect (at 2.54 -34.8) (size 2.03 2.54) (layers F.Cu F.Paste F.Mask))

  27.   (pad 2 smd rect (at 7.62 -34.8) (size 2.03 2.54) (layers F.Cu F.Paste F.Mask))

  28.   (pad 2 smd rect (at 12.7 -34.8) (size 2.03 2.54) (layers F.Cu F.Paste F.Mask))

  29.   (pad 2 thru_hole circle (at 12.7 -32.5) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask))

  30.   (pad 2 smd rect (at 12.7 -33.175) (size 0.2 1) (layers F.Cu F.Mask))

  31.   (pad 2 smd rect (at 7.62 -33.175) (size 0.2 1) (layers F.Cu F.Mask))

  32.   (pad 2 smd rect (at 2.54 -33.175) (size 0.2 1) (layers F.Cu F.Mask))

  33.   (pad 2 smd rect (at -2.54 -33.175) (size 0.2 1) (layers F.Cu F.Mask))

  34.   (pad 2 smd rect (at -7.62 -33.175) (size 0.2 1) (layers F.Cu F.Mask))

  35.   (pad 2 thru_hole circle (at 7.62 -32.5) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask))

  36.   (pad 2 thru_hole circle (at 2.54 -32.5) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask))

  37.   (pad 2 thru_hole circle (at -2.54 -32.5) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask))

  38.   (pad 2 thru_hole circle (at -7.62 -32.5) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask))

  39. )