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Add MCU part symbols and missing BGA footprint to project libraries.

tags/PRE_1
Michael Schloh von Bennewitz 4 lat temu
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3 zmienionych plików z 326 dodań i 0 usunięć
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  1. +31
    -0
      hardware/libraries/elabdev.dcm
  2. +194
    -0
      hardware/libraries/elabdev.lib
  3. +101
    -0
      hardware/modules/elabdev.pretty/TFBGA-64_8x8_6.0x6.0mm_P0.65mm.kicad_mod

+ 31
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hardware/libraries/elabdev.dcm Wyświetl plik

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EESchema-DOCLIB Version 2.0
#
$CMP ATSAMR34
D SAM R34/R35 Low Power LoRa Sub-GHz System-in-Package (SiP), Cortex-M0+ core, 256kB Flash, 40 KB RAM, 6x6mm TFBGA-64
K Atmel UHF Transceiver Microcontroller
F https://ww1.microchip.com/downloads/en/DeviceDoc/SAMR34-R35-Low-Power-LoRa-Sub-GHz-SiP-Data-Sheet-DS70005356B.pdf
$ENDCMP
#
$CMP ST25DV04K-JF
D 13.56 MHz long-range interface dynamic NFC/RFID tag, Package: UFDFPN-8, EEPROM: 5 kb, Voltage: 1,8..5,5V, I/O pins: 8
K ST25DV-I2C series Dynamic NFC Tag
F https://www.st.com/resource/datasheet/st25dv04k.pdf
$ENDCMP
#
$CMP STM32WLE5C
D LPWAN Arm Cortex-M4 MCUs, LoRa, (G)FSK, (G)MSK, BPSK, 64/128/256KB Flash, 64KB SRAM, 7x7mm UFQFPN-48
K STM32 UHF Transceiver Microcontroller
F https://www.st.com/resource/datasheet/stm32wle5jc.pdf
$ENDCMP
#
$CMP Soldfeld
D Solder Area
K sf solder feld
$ENDCMP
#
$CMP USBCHole
D USB Type C Hole
K usb hole
$ENDCMP
#
#End Doc Library

+ 194
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hardware/libraries/elabdev.lib Wyświetl plik

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EESchema-LIBRARY Version 2.4
#encoding utf-8
#
# ATSAMR34
#
DEF ATSAMR34 U 0 40 Y Y 1 F N
F0 "U" -700 1800 50 H V L CNN
F1 "ATSAMR34" 700 1800 50 H V R CNN
F2 "Elabdev:TFBGA-64_8x8_6.0x6.0mm_P0.65mm" -50 0 50 V I C CIN
F3 "https://www.microchip.com/wwwproducts/ATSAMR34J18/" 50 0 50 V I C CNN
$FPLIST
TFBGA*8x8mm*P0.65mm*
$ENDFPLIST
DRAW
S -700 1700 700 -1700 0 1 10 f
X RFI_HF A1 -800 1600 100 R 50 50 0 0 I
X GND_RF A2 -800 1500 100 R 50 50 0 0 W
X PA00 A3 -800 1400 100 R 50 50 0 0 I
X PA01 A4 -800 1300 100 R 50 50 0 0 I
X VDDCORE A5 -800 1200 100 R 50 50 0 0 I
X VSW A6 -800 1100 100 R 50 50 0 0 I
X VDDIN A7 -800 1000 100 R 50 50 0 0 I
X VDDIO2 A8 -800 900 100 R 50 50 0 0 I
X RFO_HF B1 -800 800 100 R 50 50 0 0 I
X GND_RF B2 -800 700 100 R 50 50 0 0 I
X GNDANA B3 -800 600 100 R 50 50 0 0 I
X PB02 B4 -800 500 100 R 50 50 0 0 I
X GND B5 -800 400 100 R 50 50 0 0 I
X RESET B6 -800 300 100 R 50 50 0 0 I
X GND B7 -800 200 100 R 50 50 0 0 I
X PA24 B8 -800 100 100 R 50 50 0 0 I
X VBAT_RF C1 -800 -100 100 R 50 50 0 0 I
X VDDANA C2 -800 -200 100 R 50 50 0 0 I
X PB03 C3 -800 -300 100 R 50 50 0 0 I
X PA05 C4 -800 -400 100 R 50 50 0 0 I
X PA30 C5 -800 -500 100 R 50 50 0 0 I
X PA28 C6 -800 -600 100 R 50 50 0 0 I
X PB23 C7 -800 -700 100 R 50 50 0 0 I
X PA25 C8 -800 -800 100 R 50 50 0 0 I
X VR_PA D1 -800 -900 100 R 50 50 0 0 I
X RXTX D2 -800 -1000 100 R 50 50 0 0 I
X PA04 D3 -800 -1100 100 R 50 50 0 0 I
X GND D4 -800 -1200 100 R 50 50 0 0 I
X PA31 D5 -800 -1300 100 R 50 50 0 0 I
X GND D6 -800 -1400 100 R 50 50 0 0 I
X PA23 D7 -800 -1500 100 R 50 50 0 0 I
X PA22 D8 -800 -1600 100 R 50 50 0 0 I
X GND_RF E1 800 1600 100 L 50 50 0 0 I
X GNDANA E2 800 1500 100 L 50 50 0 0 I
X PA06 E3 800 1400 100 L 50 50 0 0 I
X PA27 E4 800 1300 100 L 50 50 0 0 I
X PB22 E5 800 1200 100 L 50 50 0 0 I
X PA17 E6 800 1100 100 L 50 50 0 0 I
X PA18 E7 800 1000 100 L 50 50 0 0 I
X PA19 E8 800 900 100 L 50 50 0 0 I
X PA_BOOST F1 800 800 100 L 50 50 0 0 I
X GND_RF F2 800 700 100 L 50 50 0 0 I
X PA07 F3 800 600 100 L 50 50 0 0 I
X PA08 F4 800 500 100 L 50 50 0 0 I
X PA09 F5 800 400 100 L 50 50 0 0 I
X PA13 F6 800 300 100 L 50 50 0 0 I
X PA16 F7 800 200 100 L 50 50 0 0 I
X PA14 F8 800 100 100 L 50 50 0 0 I
X RFO_LF G1 800 -100 100 L 50 50 0 0 I
X GND_RF G2 800 -200 100 L 50 50 0 0 I
X GND_RF G3 800 -300 100 L 50 50 0 0 I
X VDDI01 G4 800 -400 100 L 50 50 0 0 I
X GND_RF G5 800 -500 100 L 50 50 0 0 I
X GND_RF G6 800 -600 100 L 50 50 0 0 I
X GND_RF G7 800 -700 100 L 50 50 0 0 I
X PA15 G8 800 -800 100 L 50 50 0 0 I
X RFI_LF H1 800 -900 100 L 50 50 0 0 I
X VR_ANA H2 800 -1000 100 L 50 50 0 0 I
X VBAT_ANA H3 800 -1100 100 L 50 50 0 0 I
X VR_DIG H4 800 -1200 100 L 50 50 0 0 I
X GND_RF H5 800 -1300 100 L 50 50 0 0 I
X XTA H6 800 -1400 100 L 50 50 0 0 I
X XTB H7 800 -1500 100 L 50 50 0 0 I
X VBAT_DIG H8 800 -1600 100 L 50 50 0 0 I
ENDDRAW
ENDDEF
#
# ST25DV04K-JF
#
DEF ST25DV04K-JF U 0 40 Y Y 1 F N
F0 "U" -500 400 50 H V C CNN
F1 "ST25DV04K-JF" 300 -400 50 H V C CNN
F2 "Elabdev:SOIC-8_3.9x4.9mm_Pitch1.27mm" 0 -500 50 H I C CIN
F3 "https://www.st.com/en/nfc/st25dv04k.html" 0 -600 50 H I C CNN
ALIAS ST25DV16K-JF ST25DV64K-JF ST25DV16K-JFR6S3 ST25DV64K-JFR6S3
DRAW
S -550 350 550 -350 0 1 10 f
X VEH 1 -700 -250 150 R 40 40 1 1 I
X AC0 2 -700 -150 150 R 40 40 1 1 P
X AC1 3 -700 -50 150 R 40 40 1 1 P
X VSS 4 700 -250 150 L 40 40 1 1 W
X SDA 5 -700 50 150 R 40 40 1 1 B
X SCL 6 -700 150 150 R 40 40 1 1 I
X GPO 7 -700 250 150 R 40 40 1 1 O
X VCC 8 700 250 150 L 40 40 1 1 W
ENDDRAW
ENDDEF
#
# STM32WLE5C
#
DEF STM32WLE5C U 0 40 Y Y 1 F N
F0 "U" -700 1800 50 H V L CNN
F1 "STM32WLE5C" 700 1800 50 H V R CNN
F2 "Package_DFN_QFN:QFN-48-1EP_7x7mm_P0.5mm_EP5.6x5.6mm" -50 0 50 V I C CIN
F3 "https://www.st.com/en/microcontrollers-microprocessors/stm32wle5jc.html" 50 0 50 V I C CNN
$FPLIST
QFN*7x7mm*P0.5mm*EP5.6x5.6mm*
$ENDFPLIST
DRAW
S -700 1700 700 -1700 0 1 10 f
X PB3 1 -800 1600 100 R 50 50 0 0 I
X PB4 2 -800 1500 100 R 50 50 0 0 W
X PB5 3 -800 1400 100 R 50 50 0 0 I
X PB6 4 -800 1300 100 R 50 50 0 0 I
X PB7 5 -800 1200 100 R 50 50 0 0 I
X PB8 6 -800 1100 100 R 50 50 0 0 I
X PA0 7 -800 1000 100 R 50 50 0 0 I
X PA1 8 -800 900 100 R 50 50 0 0 I
X PA2 9 -800 800 100 R 50 50 0 0 I
X PA3 10 -800 700 100 R 50 50 0 0 I
X VDD 11 -800 600 100 R 50 50 0 0 I
X PA4 12 -800 500 100 R 50 50 0 0 I
X PA5 13 -800 400 100 R 50 50 0 0 I
X PA6 14 -800 300 100 R 50 50 0 0 I
X PA7 15 -800 200 100 R 50 50 0 0 I
X PA8 16 -800 100 100 R 50 50 0 0 I
X PA9 17 -800 -100 100 R 50 50 0 0 I
X NRST 18 -800 -200 100 R 50 50 0 0 I
X PH3-BOOT0 19 -800 -300 100 R 50 50 0 0 I
X RFI_P 20 -800 -400 100 R 50 50 0 0 I
X RFI_N 21 -800 -500 100 R 50 50 0 0 I
X RFO_LP 22 -800 -600 100 R 50 50 0 0 I
X RFO_HP 23 -800 -700 100 R 50 50 0 0 I
X VR_PA 24 -800 -800 100 R 50 50 0 0 I
X VDD_PA 25 -800 -900 100 R 50 50 0 0 I
X OSC_IN 26 -800 -1000 100 R 50 50 0 0 I
X OSC_OUT 27 -800 -1100 100 R 50 50 0 0 I
X VDDRF 28 -800 -1200 100 R 50 50 0 0 I
X VDDRF1V55 29 -800 -1300 100 R 50 50 0 0 I
X PB0-VDD_TCXO 30 -800 -1400 100 R 50 50 0 0 I
X PB2 31 -800 -1500 100 R 50 50 0 0 I
X PB12 32 -800 -1600 100 R 50 50 0 0 I
X PA10 33 800 1600 100 L 50 50 0 0 I
X PA11 34 800 1500 100 L 50 50 0 0 I
X PA12 35 800 1400 100 L 50 50 0 0 I
X PA13 36 800 1300 100 L 50 50 0 0 I
X VBAT 37 800 1200 100 L 50 50 0 0 I
X PC13 38 800 1100 100 L 50 50 0 0 I
X PC14_OSC32_IN 39 800 1000 100 L 50 50 0 0 I
X PC15_OSC32_OUT 40 800 900 100 L 50 50 0 0 I
X VDDA 41 800 800 100 L 50 50 0 0 I
X PA14 42 800 700 100 L 50 50 0 0 I
X PA15 43 800 600 100 L 50 50 0 0 I
X VDD 44 800 500 100 L 50 50 0 0 I
X VFBSMPS 45 800 400 100 L 50 50 0 0 I
X VDDSMPS 46 800 300 100 L 50 50 0 0 I
X VLXSMPS 47 800 200 100 L 50 50 0 0 I
X VSSSMPS 48 800 100 100 L 50 50 0 0 I
ENDDRAW
ENDDEF
#
# Soldfeld
#
DEF Soldfeld SF 0 40 Y Y 1 F N
F0 "SF" 0 50 50 H V C CNN
F1 "Soldfeld" 0 -50 50 H V C CNN
F2 "Elabdev:Solderarea" 0 -200 50 H I C CNN
F3 "" 0 0 50 H I C CNN
DRAW
S -200 -150 -200 150 0 1 0 N
S -200 150 200 150 0 1 0 N
S 200 -150 -200 -150 0 1 0 N
S 200 150 200 -150 0 1 0 N
ENDDRAW
ENDDEF
#
# USBCHole
#
DEF USBCHole HL 0 40 Y Y 1 F N
F0 "HL" 200 150 50 H V C CNN
F1 "USBCHole" 0 0 50 H V C CNN
F2 "Elabdev:USBTypecHole" 0 -150 50 H I C CNN
F3 "" 0 0 50 H I C CNN
DRAW
S -250 100 250 -100 0 1 0 N
ENDDRAW
ENDDEF
#
#End Library

+ 101
- 0
hardware/modules/elabdev.pretty/TFBGA-64_8x8_6.0x6.0mm_P0.65mm.kicad_mod Wyświetl plik

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(module Elabdev:TFBGA-64_8x8_6.0x6.0mm_P0.65mm (layer F.Cu) (tedit 5F4B02FE)
(attr smd)
(fp_text reference U** (at 0 -4) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value TFBGA-64_8x8_6.0x6.0mm_P0.65mm (at 0 4) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2 -3) (end -3 -2) (layer F.Fab) (width 0.1))
(fp_line (start -3 -2) (end -3 3) (layer F.Fab) (width 0.1))
(fp_line (start -3 3) (end 3 3) (layer F.Fab) (width 0.1))
(fp_line (start 3 3) (end 3 -3) (layer F.Fab) (width 0.1))
(fp_line (start 3 -3) (end -2 -3) (layer F.Fab) (width 0.1))
(fp_line (start 1.62 -3.12) (end 3.12 -3.12) (layer F.SilkS) (width 0.12))
(fp_line (start 3.12 -3.12) (end 3.12 -1.62) (layer F.SilkS) (width 0.12))
(fp_line (start 1.62 -3.12) (end 3.12 -3.12) (layer F.SilkS) (width 0.12))
(fp_line (start 3.12 -3.12) (end 3.12 -1.62) (layer F.SilkS) (width 0.12))
(fp_line (start 1.62 3.12) (end 3.12 3.12) (layer F.SilkS) (width 0.12))
(fp_line (start 3.12 3.12) (end 3.12 1.62) (layer F.SilkS) (width 0.12))
(fp_line (start 1.62 -3.12) (end 3.12 -3.12) (layer F.SilkS) (width 0.12))
(fp_line (start 3.12 -3.12) (end 3.12 -1.62) (layer F.SilkS) (width 0.12))
(fp_line (start -1.62 3.12) (end -3.12 3.12) (layer F.SilkS) (width 0.12))
(fp_line (start -3.12 3.12) (end -3.12 1.62) (layer F.SilkS) (width 0.12))
(fp_line (start -1.62 -3.12) (end -2 -3.12) (layer F.SilkS) (width 0.12))
(fp_line (start -2 -3.12) (end -3.12 -2) (layer F.SilkS) (width 0.12))
(fp_line (start -3.12 -2) (end -3.12 -1.62) (layer F.SilkS) (width 0.12))
(fp_circle (center -3 -3) (end -3 -2.9) (layer F.SilkS) (width 0.2))
(fp_line (start -4 -4) (end 4 -4) (layer F.CrtYd) (width 0.05))
(fp_line (start 4 -4) (end 4 4) (layer F.CrtYd) (width 0.05))
(fp_line (start 4 4) (end -4 4) (layer F.CrtYd) (width 0.05))
(fp_line (start -4 4) (end -4 -4) (layer F.CrtYd) (width 0.05))
(pad A1 smd circle (at -2.275 -2.275) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad B1 smd circle (at -2.275 -1.625) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad C1 smd circle (at -2.275 -0.975) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad D1 smd circle (at -2.275 -0.325) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad E1 smd circle (at -2.275 0.325) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad F1 smd circle (at -2.275 0.975) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad G1 smd circle (at -2.275 1.625) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad H1 smd circle (at -2.275 2.275) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad A2 smd circle (at -1.625 -2.275) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad B2 smd circle (at -1.625 -1.625) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad C2 smd circle (at -1.625 -0.975) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad D2 smd circle (at -1.625 -0.325) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad E2 smd circle (at -1.625 0.325) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad F2 smd circle (at -1.625 0.975) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad G2 smd circle (at -1.625 1.625) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad H2 smd circle (at -1.625 2.275) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad A3 smd circle (at -0.975 -2.275) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad B3 smd circle (at -0.975 -1.625) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad C3 smd circle (at -0.975 -0.975) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad D3 smd circle (at -0.975 -0.325) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad E3 smd circle (at -0.975 0.325) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad F3 smd circle (at -0.975 0.975) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad G3 smd circle (at -0.975 1.625) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad H3 smd circle (at -0.975 2.275) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad A4 smd circle (at -0.325 -2.275) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad B4 smd circle (at -0.325 -1.625) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad C4 smd circle (at -0.325 -0.975) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad D4 smd circle (at -0.325 -0.325) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad E4 smd circle (at -0.325 0.325) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad F4 smd circle (at -0.325 0.975) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad G4 smd circle (at -0.325 1.625) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad H4 smd circle (at -0.325 2.275) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad A5 smd circle (at 0.325 -2.275) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad B5 smd circle (at 0.325 -1.625) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad C5 smd circle (at 0.325 -0.975) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad D5 smd circle (at 0.325 -0.325) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad E5 smd circle (at 0.325 0.325) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad F5 smd circle (at 0.325 0.975) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad G5 smd circle (at 0.325 1.625) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad H5 smd circle (at 0.325 2.275) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad A6 smd circle (at 0.975 -2.275) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad B6 smd circle (at 0.975 -1.625) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad C6 smd circle (at 0.975 -0.975) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad D6 smd circle (at 0.975 -0.325) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad E6 smd circle (at 0.975 0.325) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad F6 smd circle (at 0.975 0.975) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad G6 smd circle (at 0.975 1.625) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad H6 smd circle (at 0.975 2.275) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad A7 smd circle (at 1.625 -2.275) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad B7 smd circle (at 1.625 -1.625) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad C7 smd circle (at 1.625 -0.975) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad D7 smd circle (at 1.625 -0.325) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad E7 smd circle (at 1.625 0.325) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad F7 smd circle (at 1.625 0.975) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad G7 smd circle (at 1.625 1.625) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad H7 smd circle (at 1.625 2.275) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad A8 smd circle (at 2.275 -2.275) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad B8 smd circle (at 2.275 -1.625) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad C8 smd circle (at 2.275 -0.975) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad D8 smd circle (at 2.275 -0.325) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad E8 smd circle (at 2.275 0.325) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad F8 smd circle (at 2.275 0.975) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad G8 smd circle (at 2.275 1.625) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(pad H8 smd circle (at 2.275 2.275) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
(model ${KISYS3DMOD}/Package_BGA.3dshapes/TFBGA-64_5x5mm_Layout8x8_P0.5mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1.2 1.2 1.2))
(rotate (xyz 0 0 0))
)
)

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