Kaynağa Gözat

Partially resolve #55 by reducing vias and severed traces in the RF path.

master
ebeveyn
işleme
76f8fc95be
2 değiştirilmiş dosya ile 2057 ekleme ve 2020 silme
  1. +2027
    -2020
      hardware/dscomm.kicad_pcb
  2. +30
    -0
      hardware/rfsw-mchip.sch

+ 2027
- 2020
hardware/dscomm.kicad_pcb
Dosya farkı çok büyük olduğundan ihmal edildi
Dosyayı Görüntüle


+ 30
- 0
hardware/rfsw-mchip.sch Dosyayı Görüntüle

@@ -981,4 +981,34 @@ F 3 "~" H 2850 3600 50 0001 C CNN
$EndComp
Wire Wire Line
3050 3500 2850 3500
Text Notes 9200 2750 0 50 ~ 0
Layout connects the MCU and RF/SP3T\nfor HPOUT with two (2) via pairs, bad.
Text Notes 8750 3200 0 50 ~ 0
Layout connects the MCU and SP3T\nfor HFIN with one (1) via pair, good.
Text Notes 9100 4700 0 50 ~ 0
Layout connects the MCU and RF/SP3T\nfor HFOUT with one (1) via pair, good.
Wire Notes Line
9050 4500 9050 4750
Wire Notes Line
9050 4750 10650 4750
Wire Notes Line
10650 4750 10650 4500
Wire Notes Line
10650 4500 9050 4500
Wire Notes Line
8700 3000 8700 3250
Wire Notes Line
8700 3250 10200 3250
Wire Notes Line
10200 3250 10200 3000
Wire Notes Line
10200 3000 8700 3000
Wire Notes Line
9150 2550 9150 2800
Wire Notes Line
9150 2800 10750 2800
Wire Notes Line
10750 2800 10750 2550
Wire Notes Line
10750 2550 9150 2550
$EndSCHEMATC

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