dsendcomm

64MB

Дерево: 659c316ae0

Автор	SHA1	Повідомлення	Дата
Michael Schloh von Bennewitz	659c316ae0	Bump revision numbers, dates, and copyright pending release to manufacturing.	4 роки тому
Michael Schloh von Bennewitz	409d07abe1	Redesign panel and foil for board fabrication after adding via stiching.	4 роки тому
Michael Schloh von Bennewitz	a64db6a94c	Make a intermediate commit to track the panel design with custom planes.	4 роки тому
Michael Schloh von Bennewitz	a36d54c0dc	Update panel design pending release of 0.9.4 to board fabrication.	4 роки тому
Michael Schloh von Bennewitz	c80ec05067	Correct electronic design rules check results pending imminent release.	4 роки тому
Michael Schloh von Bennewitz	f143228cb3	Selectively remove paste apertures and replace hole cuts with drills.	4 роки тому
Michael Schloh von Bennewitz	8e9ea6370a	Generate and curate parts list, panel design, and stencil foil.	4 роки тому
Michael Schloh von Bennewitz	819a415fc9	Modify deprecated secure element model to new ATECC608B throughout.	4 роки тому
Michael Schloh von Bennewitz	b969424881	Resolve #104 by removing unconnected vias from AE5 pad 1.	4 роки тому
Michael Schloh von Bennewitz	bb8473ae5a	Complete production grade panelisation and foil design for LPKF frames.	4 роки тому