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#105 Solder chemistry is wrong for BGA
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отворен преди 4 години от Michael Schloh von Bennewitz
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Solder chemistry is wrong for BGA
Problem environment
Ball grid area (BGA) parts require prepration and consideration of flux or paste deposition. If paste is used to mitigate connection problems, the same chemistry should be used as the factory BGA parts contain.
Steps to reproduce
Expected result
We assemble using the same chemistry as BGA part specifies.
Actual result
Information is lacking to inform of the correct paste chemistry.
Workaround
Use a pasteless process replacing solder with tacky flux.
Severity level
This is medium priority because bridges and unconnected joints may result.
The manufacturer technical support staff responded that the ball grid chemistry in question is composed of tin (Sn), silver (Ag), and copper (Cu.) This is often abbreviated with SAC and is a common lead free solder paste.