Solder chemistry is wrong for BGA

Problem environment

Ball grid area (BGA) parts require prepration and consideration of flux or paste deposition. If paste is used to mitigate connection problems, the same chemistry should be used as the factory BGA parts contain.

Steps to reproduce

1. Refer to the BGA part datasheet
2. Search for information regarding chemistry

Expected result

We assemble using the same chemistry as BGA part specifies.

Actual result

Information is lacking to inform of the correct paste chemistry.

Workaround

Use a pasteless process replacing solder with tacky flux.

Severity level

This is medium priority because bridges and unconnected joints may result.

The manufacturer technical support staff responded that the ball grid chemistry in question is composed of tin (Sn), silver (Ag), and copper (Cu.) This is often abbreviated with SAC and is a common lead free solder paste.