Europalab Devices produces a LoRaWAN transmitting client node, specialised for higher research of actuator and sensor assisted IoT networks. https://dev.europalab.com/nlnet/20200000/
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Michael Schloh von Bennewitz 1dc2ba4803 Add a portable document formatted generated bill archive for hard copy. 4 vuotta sitten
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billofmat Include the approximate revision number and rearrange header and footer. 4 vuotta sitten
fabplace Update the automated placement configuration accordingly. 4 vuotta sitten
fabprint Add a portable document formatted generated bill archive for hard copy. 4 vuotta sitten
libraries Modify deprecated secure element model to new ATECC608B throughout. 4 vuotta sitten
modules Resolve #154 again by correcting the 2mm and 1,6mm mounting holes to 1,8mm. 4 vuotta sitten
.gitignore Include positions for forthcoming tool configuration and machine import. 4 vuotta sitten
LICENSE Add project infrastructure files corresponding to hardware engineering. 5 vuotta sitten
conn-mchip.sch Improve to partially accommodate #147 bus power to backpower a host. 4 vuotta sitten
conn-stmicro.sch Bump version numbers pending panelisation and prepare to manufacture. 4 vuotta sitten
ctrl-mchip.sch Try a risky consolidation of switch circuits from 39 ohm series to 220. 4 vuotta sitten
ctrl-stmicro.sch Adjust schematic labels, relabel D8 designator to D3, and regenerate layout. 4 vuotta sitten
dscomm-cache.lib Implement design review suggestions to resolve #61 and #62. 4 vuotta sitten
dscomm-frame.kicad_pcb Resolve #154 again by correcting the 2mm and 1,6mm mounting holes to 1,8mm. 4 vuotta sitten
dscomm-panel.kicad_pcb Correct electronic design rules check results pending imminent release. 4 vuotta sitten
dscomm-panel.pro Complete production grade panelisation and foil design for LPKF frames. 4 vuotta sitten
dscomm-stencil.kicad_pcb Selectively remove paste apertures and replace hole cuts with drills. 4 vuotta sitten
dscomm-stencil.pro Complete production grade panelisation and foil design for LPKF frames. 4 vuotta sitten
dscomm-tstjig.kicad_pcb Add a specifications based representation of a J-Link mini device. 4 vuotta sitten
dscomm-tstjig.pro Add mounting holes to the test jig and avoid upside down text in panels. 4 vuotta sitten
dscomm.kicad_pcb Reverse UFL and try to finish chip antenna and 50 ohm feed line traces. 4 vuotta sitten
dscomm.net Try a risky consolidation of switch circuits from 39 ohm series to 220. 4 vuotta sitten
dscomm.pro Correct recent tolerance configuration with redundant via diamters. 4 vuotta sitten
dscomm.sch Reposition fiducials according to automation test results, and add FID6. 4 vuotta sitten
elabdev-black.kicad_wks Include more project boilerplate structure and library cache. 4 vuotta sitten
elabdev-white.kicad_wks Include more project boilerplate structure and library cache. 4 vuotta sitten
feat-mchip.sch Resolve #164 by consolidating most parts in the comment suggestion. 4 vuotta sitten
form-arduino.kicad_pcb Bump hardware revision number pending tag for design review. 4 vuotta sitten
form-arduino.pro Complete milestone 'Blank FR4 design' for remaining device formats. 4 vuotta sitten
form-arduino.sch Bump version numbers pending panelisation and prepare to manufacture. 4 vuotta sitten
form-beagle.kicad_pcb Bump hardware revision number pending tag for design review. 4 vuotta sitten
form-beagle.pro Complete milestone 'Blank FR4 design' for remaining device formats. 4 vuotta sitten
form-beagle.sch Bump version numbers pending panelisation and prepare to manufacture. 4 vuotta sitten
form-bmicro.kicad_pcb Bump hardware revision number pending tag for design review. 4 vuotta sitten
form-bmicro.pro Redevelop, correct corners, and add connections to format variants. 4 vuotta sitten
form-bmicro.sch Bump version numbers pending panelisation and prepare to manufacture. 4 vuotta sitten
form-frdm.kicad_pcb Bump hardware revision number pending tag for design review. 4 vuotta sitten
form-frdm.pro Redevelop, correct corners, and add connections to format variants. 4 vuotta sitten
form-frdm.sch Bump version numbers pending panelisation and prepare to manufacture. 4 vuotta sitten
fp-lib-table Redesign for STM32WL SoC architecture, add features, and bump version. 4 vuotta sitten
pwr-stmicro.sch Bump version numbers pending panelisation and prepare to manufacture. 4 vuotta sitten
rfsw-mchip.sch Work on #141 by integrating pi networks to match impedence in antennas. 4 vuotta sitten
rfsw-stmicro.sch Bump version numbers pending panelisation and prepare to manufacture. 4 vuotta sitten
sym-lib-table Integrate local symbols and footprint libraries pending components. 4 vuotta sitten