Europalab Devices produces a LoRaWAN transmitting client node, specialised for higher research of actuator and sensor assisted IoT networks. https://dev.europalab.com/nlnet/20200000/
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Michael Schloh von Bennewitz d8106ebb3a Add structures and circuits to support forthcoming test jig construction. 4 年前
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billofmat Work on #141 by integrating pi networks to match impedence in antennas. 4 年前
fabplace Develop the placement configuration pending assembly of release 0.9.2. 4 年前
fabprint Regenerate portable document format schematic capture for update. 4 年前
libraries Modify deprecated secure element model to new ATECC608B throughout. 4 年前
modules Add forgotten but used in layout replacement for cut holes a module. 4 年前
.gitignore Include positions for forthcoming tool configuration and machine import. 4 年前
LICENSE Add project infrastructure files corresponding to hardware engineering. 5 年前
conn-mchip.sch Add structures and circuits to support forthcoming test jig construction. 4 年前
conn-stmicro.sch Bump version numbers pending panelisation and prepare to manufacture. 4 年前
ctrl-mchip.sch Bump version numbers pending panelisation and prepare to manufacture. 4 年前
ctrl-stmicro.sch Bump version numbers pending panelisation and prepare to manufacture. 4 年前
dscomm-cache.lib Implement design review suggestions to resolve #61 and #62. 4 年前
dscomm-panel.kicad_pcb Correct electronic design rules check results pending imminent release. 4 年前
dscomm-panel.pro Complete production grade panelisation and foil design for LPKF frames. 4 年前
dscomm-stencil.kicad_pcb Selectively remove paste apertures and replace hole cuts with drills. 4 年前
dscomm-stencil.pro Complete production grade panelisation and foil design for LPKF frames. 4 年前
dscomm-tstjig.kicad_pcb Add structures and circuits to support forthcoming test jig construction. 4 年前
dscomm-tstjig.pro Add structures and circuits to support forthcoming test jig construction. 4 年前
dscomm.kicad_pcb Add structures and circuits to support forthcoming test jig construction. 4 年前
dscomm.net Add structures and circuits to support forthcoming test jig construction. 4 年前
dscomm.pro Regenerate portable document format schematic capture for update. 4 年前
dscomm.sch Selectively remove paste apertures and replace hole cuts with drills. 4 年前
elabdev-black.kicad_wks Include more project boilerplate structure and library cache. 4 年前
elabdev-white.kicad_wks Include more project boilerplate structure and library cache. 4 年前
feat-mchip.sch Bump version numbers pending panelisation and prepare to manufacture. 4 年前
form-arduino.kicad_pcb Bump hardware revision number pending tag for design review. 4 年前
form-arduino.pro Complete milestone 'Blank FR4 design' for remaining device formats. 4 年前
form-arduino.sch Bump version numbers pending panelisation and prepare to manufacture. 4 年前
form-beagle.kicad_pcb Bump hardware revision number pending tag for design review. 4 年前
form-beagle.pro Complete milestone 'Blank FR4 design' for remaining device formats. 4 年前
form-beagle.sch Bump version numbers pending panelisation and prepare to manufacture. 4 年前
form-bmicro.kicad_pcb Bump hardware revision number pending tag for design review. 4 年前
form-bmicro.pro Redevelop, correct corners, and add connections to format variants. 4 年前
form-bmicro.sch Bump version numbers pending panelisation and prepare to manufacture. 4 年前
form-frdm.kicad_pcb Bump hardware revision number pending tag for design review. 4 年前
form-frdm.pro Redevelop, correct corners, and add connections to format variants. 4 年前
form-frdm.sch Bump version numbers pending panelisation and prepare to manufacture. 4 年前
fp-lib-table Redesign for STM32WL SoC architecture, add features, and bump version. 4 年前
pwr-stmicro.sch Bump version numbers pending panelisation and prepare to manufacture. 4 年前
rfsw-mchip.sch Work on #141 by integrating pi networks to match impedence in antennas. 4 年前
rfsw-stmicro.sch Bump version numbers pending panelisation and prepare to manufacture. 4 年前
sym-lib-table Integrate local symbols and footprint libraries pending components. 4 年前