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Bump version number pending layout engineering of STM32WL SiP migration.

tags/PRE_2
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  1. +2
    -2
      hardware/dscomm.kicad_pcb

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- 2
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@@ -13,7 +13,7 @@
(title_block
(title "Democratic Sendcomm")
(date 2020-10-20)
(rev 0.8.4)
(rev 0.8.5)
(company "Europalab Devices")
(comment 1 "Copyright © 2020, Europalab Devices")
(comment 2 "Fulfilling requirements of 20200210")
@@ -5486,7 +5486,7 @@
(pad 8 smd roundrect (at -3.75 -1) (size 2 1.5) (layers B.Cu B.Mask) (roundrect_rratio 0.25))
)

(gr_text "Hardware revision 0.8.4" (at 230 128) (layer B.SilkS) (tstamp 5F701572)
(gr_text "Hardware revision 0.8.5" (at 230 128) (layer B.SilkS) (tstamp 5F701572)
(effects (font (size 2.125 2.125) (thickness 0.5)) (justify left mirror))
)
(gr_text Daughterboard (at 221 145) (layer B.SilkS)


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