Bump version number pending layout engineering of STM32WL SiP migration.

hardware/dscomm.kicad_pcb

@@ -13,7 +13,7 @@
   (title_block
     (title "Democratic Sendcomm")
     (date 2020-10-20)
-    (rev 0.8.4)
+    (rev 0.8.5)
     (company "Europalab Devices")
     (comment 1 "Copyright © 2020, Europalab Devices")
     (comment 2 "Fulfilling requirements of 20200210")
@@ -5486,7 +5486,7 @@
     (pad 8 smd roundrect (at -3.75 -1) (size 2 1.5) (layers B.Cu B.Mask) (roundrect_rratio 0.25))
   )
 
-  (gr_text "Hardware revision 0.8.4" (at 230 128) (layer B.SilkS) (tstamp 5F701572)
+  (gr_text "Hardware revision 0.8.5" (at 230 128) (layer B.SilkS) (tstamp 5F701572)
     (effects (font (size 2.125 2.125) (thickness 0.5)) (justify left mirror))
   )
   (gr_text Daughterboard (at 221 145) (layer B.SilkS)