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dsendcomm
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3 Commits (04d94df71d7125b50e3820e028d4f73978c36d55)

Author SHA1 Message Date
  Michael Schloh von Bennewitz 7519f8f491 Adjust ball pad clearance and solder mask aperature to allow sanity. 4 years ago
  Michael Schloh von Bennewitz a71b05cc81 Prepare for layout edition in BGA with corresponding traces and vias. 4 years ago
  Michael Schloh von Bennewitz 425ff0092a Add MCU part symbols and missing BGA footprint to project libraries. 4 years ago