144 Révisions (8c6be817829adebd2ed02dd37632ee0be66e4ed5)
 

Auteur SHA1 Message Date
  Michael Schloh von Bennewitz 8c6be81782 Update generated schematic output to correspond with current design. il y a 4 ans
  Michael Schloh von Bennewitz 89c95b975f Bump hardware revision number pending tag for design review. il y a 4 ans
  Michael Schloh von Bennewitz 8c114dd4b4 Correct optional PA14_XIN and PA15_XOUT external crystal floating pins. il y a 4 ans
  Michael Schloh von Bennewitz 52eec91b20 Correct HSE circuit and remove JP26, add RFSW testpoints and text. il y a 4 ans
  Michael Schloh von Bennewitz 7c358ddd46 Resolve #114 by replacing flawed 27 pF value with 2,7 pF throughout. il y a 4 ans
  Michael Schloh von Bennewitz 68066fe6a9 Include a portable document format rendition of the schematic. il y a 4 ans
  Michael Schloh von Bennewitz b6cc59333c Correct secure element model number to support easy TTN integration. il y a 4 ans
  Michael Schloh von Bennewitz 819a415fc9 Modify deprecated secure element model to new ATECC608B throughout. il y a 4 ans
  Michael Schloh von Bennewitz f6764b5d5e Add top layer test points to connect with bottom layer solder grid. il y a 4 ans
  Michael Schloh von Bennewitz b969424881 Resolve #104 by removing unconnected vias from AE5 pad 1. il y a 4 ans
  Michael Schloh von Bennewitz 40a2b218fe Redevelop, correct corners, and add connections to format variants. il y a 4 ans
  Michael Schloh von Bennewitz 060584f6bc Complete milestone 'Blank FR4 design' for remaining device formats. il y a 4 ans
  Michael Schloh von Bennewitz bb8473ae5a Complete production grade panelisation and foil design for LPKF frames. il y a 4 ans
  Michael Schloh von Bennewitz 6697d42f59 Correct misplaced designator text label rotated in the last commit. il y a 4 ans
  Michael Schloh von Bennewitz 9a29ebfc09 Resolve #97 by redesigning the QFN-12 footprint used for the U4 RF switch. il y a 4 ans
  Michael Schloh von Bennewitz a2b385851b Add handwritten signature decorative text to bottom silkscreen. il y a 4 ans
  Michael Schloh von Bennewitz b727e44ef5 Resolve DRC errors and panelise irregular tabs for consistency. il y a 4 ans
  Michael Schloh von Bennewitz 62e6e0b06b Regenerate and commit the netlist reflecting the power flag addition. il y a 4 ans
  Michael Schloh von Bennewitz 0753ffa445 Resolve a false positive on ERC by adding a power flag to a supply input. il y a 4 ans
  Michael Schloh von Bennewitz 73d2e45c06 Improve continuity of the ground plane of the top layer by adding a via. il y a 4 ans
  Michael Schloh von Bennewitz dde5e9ffb4 Bump revision pending release to panelisation and imminent fabrication. il y a 4 ans
  Michael Schloh von Bennewitz 7c2b89e222 Correct flawed U2 package size and bump revision pending release. il y a 4 ans
  Michael Schloh von Bennewitz 3c10b0797f Modify placement of J1 battery power selection jumper to improve access. il y a 4 ans
  Michael Schloh von Bennewitz a66f58cfd3 Align placement of resistor at R3 to the existing resistor at R2. il y a 4 ans
  Michael Schloh von Bennewitz 55a0f50266 Resolve #71 by replacing the 0402 part with a same brand 0805 part. il y a 4 ans
  Michael Schloh von Bennewitz 0d38f32cf8 Reduce length of antenna selection jumper traces to improve signal. il y a 4 ans
  Michael Schloh von Bennewitz 6969e8e3f0 Complete partially implemented RF switch power selection jumper. il y a 4 ans
  Michael Schloh von Bennewitz 7da0bfb1b5 Connect spring contacts for daughterboard and add jumper to resolve #88. il y a 4 ans
  Michael Schloh von Bennewitz b4f491a6d1 Add a ambient light sensor circuit and route to the MCU. il y a 4 ans
  Michael Schloh von Bennewitz 06ee3e4234 Resolve #80 and #89 by adding a 1 uF decoupling capacitor and connector. il y a 4 ans
  Michael Schloh von Bennewitz 787e5fed89 Resolve #76 by replacing triangle solder jumper shapes with ovals. il y a 4 ans
  Michael Schloh von Bennewitz 7e32c82a2f Resolve #75 by replacing header pin footprints with solder jumpers. il y a 4 ans
  Michael Schloh von Bennewitz 8e36a89bf0 Resolve #72 and #74 by rerouting traces, jumpers, and pads. il y a 4 ans
  Michael Schloh von Bennewitz 5547c5c17c Correct bottom ground plane cohesion across island regions. il y a 4 ans
  Michael Schloh von Bennewitz d1de14d468 Resolve #81 and #82 by replacing oscillator circuit and inductors. il y a 4 ans
  Michael Schloh von Bennewitz fbd2c4d64f Include bottom layer positions for tool configuration and machine import. il y a 4 ans
  Michael Schloh von Bennewitz be68447c46 Improve position of bottom layer silkscreen text for designators. il y a 4 ans
  Michael Schloh von Bennewitz b568796a8b Include placer tooling configuration for forthcoming assembly step. il y a 4 ans
  Michael Schloh von Bennewitz ae8846b0ec Include positions for forthcoming tool configuration and machine import. il y a 4 ans
  Michael Schloh von Bennewitz 3729b8a295 Work around reference design flaw #58 by replacing with a ferrite bead. il y a 4 ans
  Michael Schloh von Bennewitz ec0c1a052e Mostly complete the bill of materials, and prepare to order parts. il y a 4 ans
  Michael Schloh von Bennewitz ec01c3156c Replace PTS with KSC tactile switch type after testing quality in #43. il y a 4 ans
  Michael Schloh von Bennewitz 1697e5268f Record an out of scope concept to integrate FOMU in design to bookmark. il y a 4 ans
  Michael Schloh von Bennewitz 6fb5a11d72 Remove leading zero character in single digit line numbers. il y a 4 ans
  Michael Schloh von Bennewitz a4609e6dc6 Correct flawed CSV syntax and information for the recent audio sensor. il y a 4 ans
  Michael Schloh von Bennewitz 9893372af8 Improve wording and make identifiers more descriptive and consistent. il y a 4 ans
  Michael Schloh von Bennewitz 5c4a108373 Include a bill of materials for recently designed STM32WL architecture. il y a 4 ans
  Michael Schloh von Bennewitz 6c5b7f37b9 Commit overlooked file name change from previous renaming. il y a 4 ans
  Michael Schloh von Bennewitz dde3d94692 Add forgotten Raspberry Pi 40W female connector material information. il y a 4 ans
  Michael Schloh von Bennewitz 22eb0a237f Rename the bill of materials associated with Microchip SiP parts. il y a 4 ans