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8 Commits (062c71befc36a51ef9cc9f935e17a716eced0d75)

Author SHA1 Message Date
  Michael Schloh von Bennewitz f4a7a6cc9f Bump version numbers pending panelisation and prepare to manufacture. 4 years ago
  Michael Schloh von Bennewitz 89c95b975f Bump hardware revision number pending tag for design review. 4 years ago
  Michael Schloh von Bennewitz 40a2b218fe Redevelop, correct corners, and add connections to format variants. 4 years ago
  Michael Schloh von Bennewitz dde5e9ffb4 Bump revision pending release to panelisation and imminent fabrication. 4 years ago
  Michael Schloh von Bennewitz 7b4a5a9ded Correct TSNP package name after adding corresponding footprint. 4 years ago
  Michael Schloh von Bennewitz 9a36de62c9 Correct footprint related flaws in preparation for layout edition. 4 years ago
  Michael Schloh von Bennewitz 06be85075b Renumber and bump version pending layout edition of ST SoC migration. 4 years ago
  Michael Schloh von Bennewitz e1e0f5c1d5 Redesign for STM32WL SoC architecture, add features, and bump version. 4 years ago
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