27 コミット (4f3db6f44af508de18394c1b9b8c936abe573501)

作成者 SHA1 メッセージ 日付
  Michael Schloh von Bennewitz 4f3db6f44a Correct USB bus power circuit according to reference design and adjust. 4年前
  Michael Schloh von Bennewitz 1c8ea4862a Implement design review suggestions to resolve #61 and #62. 4年前
  Michael Schloh von Bennewitz 95df65933d Resolve #128 by rerouting bus power to PA07 F3 to bus test circuit. 4年前
  Michael Schloh von Bennewitz 1f2fe604d8 Connect pads from pogo pin test matrix to GND and 3V3 to future proof. 4年前
  Michael Schloh von Bennewitz 89c95b975f Bump hardware revision number pending tag for design review. 4年前
  Michael Schloh von Bennewitz f6764b5d5e Add top layer test points to connect with bottom layer solder grid. 4年前
  Michael Schloh von Bennewitz 40a2b218fe Redevelop, correct corners, and add connections to format variants. 4年前
  Michael Schloh von Bennewitz dde5e9ffb4 Bump revision pending release to panelisation and imminent fabrication. 4年前
  Michael Schloh von Bennewitz 06ee3e4234 Resolve #80 and #89 by adding a 1 uF decoupling capacitor and connector. 4年前
  Michael Schloh von Bennewitz 8e36a89bf0 Resolve #72 and #74 by rerouting traces, jumpers, and pads. 4年前
  Michael Schloh von Bennewitz fa1bcf02a3 Add a Grove connector, audio level sensor, and remove a UART test point. 4年前
  Michael Schloh von Bennewitz f332c465c1 Correct serial connector library symbol for future compatability. 4年前
  Michael Schloh von Bennewitz 06be85075b Renumber and bump version pending layout edition of ST SoC migration. 4年前
  Michael Schloh von Bennewitz f124b45881 Correct flawed connector symbol in schematic for SiP architecture. 4年前
  Michael Schloh von Bennewitz e1e0f5c1d5 Redesign for STM32WL SoC architecture, add features, and bump version. 4年前
  Michael Schloh von Bennewitz 5da94c3830 Include a solderfield breadboard to support daughterboard development. 4年前
  Michael Schloh von Bennewitz c0aa16f26e Resolve #35 add a board to board connector to prepare daughterboards. 4年前
  Michael Schloh von Bennewitz 6c7b76d799 Bump hardware revision number pending milestone progress and test cycle. 4年前
  Michael Schloh von Bennewitz 2fa32f80c2 Add test points to allow flexible postassembly prototype debugging. 4年前
  Michael Schloh von Bennewitz cc5a03834a Correct power circuit in LED parts that require a power flag. 4年前
  Michael Schloh von Bennewitz 636ecc14e6 Correct flawed ground short in secure element authentication circuit. 4年前
  Michael Schloh von Bennewitz 57d2b72b53 Add test point loops and correct sized mounting holes. 4年前
  Michael Schloh von Bennewitz 2a1cbb6ddb Add nested part to allow either DFN or SOIC EEPROMs to be used. 4年前
  Michael Schloh von Bennewitz 69acaf3e33 Add EEPROM, jumpers, and connector pending migration to hat format. 4年前
  Michael Schloh von Bennewitz 54e8c2e73c Correct schematics after electric rules check results in warnings. 4年前
  Michael Schloh von Bennewitz a88a134751 Update existing schematics after modification and subsequent reannotation. 4年前
  Michael Schloh von Bennewitz fc60477441 Correct poor abstraction bug #4 and generally complete Microchip circuits. 4年前