 Michael Schloh von Bennewitz
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73d2e45c06
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Improve continuity of the ground plane of the top layer by adding a via.
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4年前 |
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Michael Schloh von Bennewitz
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dde5e9ffb4
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Bump revision pending release to panelisation and imminent fabrication.
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4年前 |
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Michael Schloh von Bennewitz
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7c2b89e222
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Correct flawed U2 package size and bump revision pending release.
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4年前 |
 Michael Schloh von Bennewitz
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3c10b0797f
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Modify placement of J1 battery power selection jumper to improve access.
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4年前 |
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Michael Schloh von Bennewitz
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a66f58cfd3
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Align placement of resistor at R3 to the existing resistor at R2.
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4年前 |
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Michael Schloh von Bennewitz
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55a0f50266
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Resolve #71 by replacing the 0402 part with a same brand 0805 part.
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4年前 |
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Michael Schloh von Bennewitz
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0d38f32cf8
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Reduce length of antenna selection jumper traces to improve signal.
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4年前 |
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Michael Schloh von Bennewitz
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6969e8e3f0
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Complete partially implemented RF switch power selection jumper.
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4年前 |
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Michael Schloh von Bennewitz
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7da0bfb1b5
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Connect spring contacts for daughterboard and add jumper to resolve #88.
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4年前 |
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Michael Schloh von Bennewitz
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b4f491a6d1
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Add a ambient light sensor circuit and route to the MCU.
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4年前 |
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Michael Schloh von Bennewitz
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06ee3e4234
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Resolve #80 and #89 by adding a 1 uF decoupling capacitor and connector.
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4年前 |
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Michael Schloh von Bennewitz
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787e5fed89
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Resolve #76 by replacing triangle solder jumper shapes with ovals.
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4年前 |
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Michael Schloh von Bennewitz
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7e32c82a2f
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Resolve #75 by replacing header pin footprints with solder jumpers.
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4年前 |
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Michael Schloh von Bennewitz
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8e36a89bf0
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Resolve #72 and #74 by rerouting traces, jumpers, and pads.
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4年前 |
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Michael Schloh von Bennewitz
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5547c5c17c
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Correct bottom ground plane cohesion across island regions.
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4年前 |
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Michael Schloh von Bennewitz
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d1de14d468
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Resolve #81 and #82 by replacing oscillator circuit and inductors.
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4年前 |
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Michael Schloh von Bennewitz
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fbd2c4d64f
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Include bottom layer positions for tool configuration and machine import.
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4年前 |
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Michael Schloh von Bennewitz
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be68447c46
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Improve position of bottom layer silkscreen text for designators.
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4年前 |
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Michael Schloh von Bennewitz
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b568796a8b
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Include placer tooling configuration for forthcoming assembly step.
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4年前 |
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Michael Schloh von Bennewitz
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ae8846b0ec
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Include positions for forthcoming tool configuration and machine import.
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4年前 |
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Michael Schloh von Bennewitz
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3729b8a295
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Work around reference design flaw #58 by replacing with a ferrite bead.
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4年前 |
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Michael Schloh von Bennewitz
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ec0c1a052e
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Mostly complete the bill of materials, and prepare to order parts.
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4年前 |
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Michael Schloh von Bennewitz
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ec01c3156c
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Replace PTS with KSC tactile switch type after testing quality in #43.
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4年前 |
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Michael Schloh von Bennewitz
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1697e5268f
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Record an out of scope concept to integrate FOMU in design to bookmark.
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4年前 |
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Michael Schloh von Bennewitz
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6fb5a11d72
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Remove leading zero character in single digit line numbers.
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4年前 |
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Michael Schloh von Bennewitz
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a4609e6dc6
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Correct flawed CSV syntax and information for the recent audio sensor.
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4年前 |
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Michael Schloh von Bennewitz
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9893372af8
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Improve wording and make identifiers more descriptive and consistent.
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4年前 |
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Michael Schloh von Bennewitz
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5c4a108373
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Include a bill of materials for recently designed STM32WL architecture.
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4年前 |
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Michael Schloh von Bennewitz
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6c5b7f37b9
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Commit overlooked file name change from previous renaming.
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4年前 |
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Michael Schloh von Bennewitz
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dde3d94692
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Add forgotten Raspberry Pi 40W female connector material information.
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4年前 |
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Michael Schloh von Bennewitz
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22eb0a237f
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Rename the bill of materials associated with Microchip SiP parts.
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4年前 |
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Michael Schloh von Bennewitz
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cd5e47e89f
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Integrate new audio level sensor library symbol and regenerate netlists.
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4年前 |
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Michael Schloh von Bennewitz
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6e8d767677
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Correct TSNP name, adjust crystal capacitors, and add an audio sensor.
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4年前 |
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Michael Schloh von Bennewitz
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7b4a5a9ded
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Correct TSNP package name after adding corresponding footprint.
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4年前 |
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Michael Schloh von Bennewitz
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fa1bcf02a3
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Add a Grove connector, audio level sensor, and remove a UART test point.
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4年前 |
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Michael Schloh von Bennewitz
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7435efc28c
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Add a library symbol for the soon to be added audio level sensor.
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4年前 |
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Michael Schloh von Bennewitz
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04a0c9943b
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Add footprints and shaded models for soon to be added sensors.
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4年前 |
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Michael Schloh von Bennewitz
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166e5a0520
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Correct TSNP package name and adjust crystal capacitors accordingly.
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4年前 |
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Michael Schloh von Bennewitz
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f332c465c1
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Correct serial connector library symbol for future compatability.
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4年前 |
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Michael Schloh von Bennewitz
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7e9d77859b
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Bump version number pending layout engineering of STM32WL SiP migration.
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4年前 |
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Michael Schloh von Bennewitz
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9a36de62c9
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Correct footprint related flaws in preparation for layout edition.
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4年前 |
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Michael Schloh von Bennewitz
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06be85075b
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Renumber and bump version pending layout edition of ST SoC migration.
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4年前 |
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Michael Schloh von Bennewitz
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1f6ccf22da
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Improve placement of RF switch circuits by centering entire schematic.
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4年前 |
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Michael Schloh von Bennewitz
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f124b45881
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Correct flawed connector symbol in schematic for SiP architecture.
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4年前 |
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Michael Schloh von Bennewitz
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e1e0f5c1d5
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Redesign for STM32WL SoC architecture, add features, and bump version.
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4年前 |
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Michael Schloh von Bennewitz
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b40d64841f
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Add a comment collumn to accommodate do not place (DNP) parts.
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4年前 |
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Michael Schloh von Bennewitz
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494fcf43c1
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Complete bill of materials for current prototype design revision 0.8.2.
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4年前 |
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Michael Schloh von Bennewitz
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cff212170b
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Add a paste layer to NPTH mounts to configure for foil apertures.
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4年前 |
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Michael Schloh von Bennewitz
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44bdd2e1e4
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Bump hardware revision number pending release to manufacturing.
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4年前 |
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Michael Schloh von Bennewitz
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65fc253676
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Add panel support like mouse bite integrated tabs for panelisation.
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4年前 |
