Michael Schloh von Bennewitz
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dde5e9ffb4
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Bump revision pending release to panelisation and imminent fabrication.
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4 년 전 |
Michael Schloh von Bennewitz
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7b4a5a9ded
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Correct TSNP package name after adding corresponding footprint.
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4 년 전 |
Michael Schloh von Bennewitz
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9a36de62c9
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Correct footprint related flaws in preparation for layout edition.
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4 년 전 |
Michael Schloh von Bennewitz
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06be85075b
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Renumber and bump version pending layout edition of ST SoC migration.
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4 년 전 |
Michael Schloh von Bennewitz
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e1e0f5c1d5
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Redesign for STM32WL SoC architecture, add features, and bump version.
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4 년 전 |