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dsendcomm
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4 Commits (e1e0f5c1d563c24624d32f6fd190a43527d17a5c)

Author SHA1 Message Date
  Michael Schloh von Bennewitz e1e0f5c1d5 Redesign for STM32WL SoC architecture, add features, and bump version. 4 years ago
  Michael Schloh von Bennewitz 7519f8f491 Adjust ball pad clearance and solder mask aperature to allow sanity. 5 years ago
  Michael Schloh von Bennewitz a71b05cc81 Prepare for layout edition in BGA with corresponding traces and vias. 5 years ago
  Michael Schloh von Bennewitz 425ff0092a Add MCU part symbols and missing BGA footprint to project libraries. 5 years ago