NLNetfound
/
dsendcomm
2
2
Разклонения 0
Код Задачи 82 Заявки за сливане 0 Версии 5 Уики Activity
Europalab Devices produces a LoRaWAN transmitting client node, specialised for higher research of actuator and sensor assisted IoT networks. https://dev.europalab.com/nlnet/20200000/
You can not select more than 25 topics Topics must start with a letter or number, can include dashes ('-') and can be up to 35 characters long.
125 Ревизии
1 Клон
64MB
ИН на ревизия: 73d2e45c06
Клонове Маркери
${ item.name }
Create branch ${ searchTerm }
от '73d2e45c06'
${ noResults }
dsendcomm/hardware
Michael Schloh von Bennewitz 73d2e45c06 Improve continuity of the ground plane of the top layer by adding a via. преди 4 години
..
billofmat Correct flawed U2 package size and bump revision pending release. преди 4 години
fabplace Include bottom layer positions for tool configuration and machine import. преди 4 години
libraries Add a library symbol for the soon to be added audio level sensor. преди 4 години
modules Add footprints and shaded models for soon to be added sensors. преди 4 години
.gitignore Include positions for forthcoming tool configuration and machine import. преди 4 години
LICENSE Add project infrastructure files corresponding to hardware engineering. преди 5 години
conn-mchip.sch Bump revision pending release to panelisation and imminent fabrication. преди 4 години
conn-stmicro.sch Bump revision pending release to panelisation and imminent fabrication. преди 4 години
ctrl-mchip.sch Correct flawed U2 package size and bump revision pending release. преди 4 години
ctrl-stmicro.sch Bump revision pending release to panelisation and imminent fabrication. преди 4 години
dscomm-cache.lib Resolve #80 and #89 by adding a 1 uF decoupling capacitor and connector. преди 4 години
dscomm.kicad_pcb Improve continuity of the ground plane of the top layer by adding a via. преди 4 години
dscomm.net Correct flawed U2 package size and bump revision pending release. преди 4 години
dscomm.pro Adjust track width, via drills, and annular rings to minimum specs. преди 4 години
dscomm.sch Bump revision pending release to panelisation and imminent fabrication. преди 4 години
elabdev-black.kicad_wks Include more project boilerplate structure and library cache. преди 4 години
elabdev-white.kicad_wks Include more project boilerplate structure and library cache. преди 4 години
feat-mchip.sch Bump revision pending release to panelisation and imminent fabrication. преди 4 години
fp-lib-table Redesign for STM32WL SoC architecture, add features, and bump version. преди 4 години
pwr-stmicro.sch Bump revision pending release to panelisation and imminent fabrication. преди 4 години
rfsw-mchip.sch Bump revision pending release to panelisation and imminent fabrication. преди 4 години
rfsw-stmicro.sch Bump revision pending release to panelisation and imminent fabrication. преди 4 години
sym-lib-table Integrate local symbols and footprint libraries pending components. преди 4 години