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Europalab Devices produces a LoRaWAN transmitting client node, specialised for higher research of actuator and sensor assisted IoT networks. https://dev.europalab.com/nlnet/20200000/
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Struktur: 73d2e45c06
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dsendcomm/hardware
Michael Schloh von Bennewitz 73d2e45c06 Improve continuity of the ground plane of the top layer by adding a via. vor 4 Jahren
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billofmat Correct flawed U2 package size and bump revision pending release. vor 4 Jahren
fabplace Include bottom layer positions for tool configuration and machine import. vor 4 Jahren
libraries Add a library symbol for the soon to be added audio level sensor. vor 4 Jahren
modules Add footprints and shaded models for soon to be added sensors. vor 4 Jahren
.gitignore Include positions for forthcoming tool configuration and machine import. vor 4 Jahren
LICENSE Add project infrastructure files corresponding to hardware engineering. vor 5 Jahren
conn-mchip.sch Bump revision pending release to panelisation and imminent fabrication. vor 4 Jahren
conn-stmicro.sch Bump revision pending release to panelisation and imminent fabrication. vor 4 Jahren
ctrl-mchip.sch Correct flawed U2 package size and bump revision pending release. vor 4 Jahren
ctrl-stmicro.sch Bump revision pending release to panelisation and imminent fabrication. vor 4 Jahren
dscomm-cache.lib Resolve #80 and #89 by adding a 1 uF decoupling capacitor and connector. vor 4 Jahren
dscomm.kicad_pcb Improve continuity of the ground plane of the top layer by adding a via. vor 4 Jahren
dscomm.net Correct flawed U2 package size and bump revision pending release. vor 4 Jahren
dscomm.pro Adjust track width, via drills, and annular rings to minimum specs. vor 4 Jahren
dscomm.sch Bump revision pending release to panelisation and imminent fabrication. vor 4 Jahren
elabdev-black.kicad_wks Include more project boilerplate structure and library cache. vor 4 Jahren
elabdev-white.kicad_wks Include more project boilerplate structure and library cache. vor 4 Jahren
feat-mchip.sch Bump revision pending release to panelisation and imminent fabrication. vor 4 Jahren
fp-lib-table Redesign for STM32WL SoC architecture, add features, and bump version. vor 4 Jahren
pwr-stmicro.sch Bump revision pending release to panelisation and imminent fabrication. vor 4 Jahren
rfsw-mchip.sch Bump revision pending release to panelisation and imminent fabrication. vor 4 Jahren
rfsw-stmicro.sch Bump revision pending release to panelisation and imminent fabrication. vor 4 Jahren
sym-lib-table Integrate local symbols and footprint libraries pending components. vor 4 Jahren