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billofmat
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Complete resolution of #172 by adding a bill of materials part entry.
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vor 3 Jahren |
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fabplace
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Backport decrease of luminosity modification for D3/R40 power LED pair.
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vor 3 Jahren |
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fabprint
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Complete resolution of #172 by adding a bill of materials part entry.
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vor 3 Jahren |
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libraries
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Modify deprecated secure element model to new ATECC608B throughout.
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vor 3 Jahren |
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modules
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Solve the problem causing a layout error (79794b0) in the part footprint.
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vor 3 Jahren |
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.gitignore
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Include positions for forthcoming tool configuration and machine import.
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vor 3 Jahren |
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LICENSE
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Add project infrastructure files corresponding to hardware engineering.
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vor 4 Jahren |
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conn-mchip.sch
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Modify and consolidate both ferrite beads according to manufacturer advice.
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vor 3 Jahren |
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conn-stmicro.sch
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Bump revision numbers, dates, and copyright pending release to manufacturing.
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vor 3 Jahren |
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ctrl-mchip.sch
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Replace 1K value with 2K4 for R40 to dim power indicator LED D3.
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vor 3 Jahren |
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ctrl-stmicro.sch
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Bump revision numbers, dates, and copyright pending release to manufacturing.
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vor 3 Jahren |
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dscomm-cache.lib
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Implement design review suggestions to resolve #61 and #62.
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vor 3 Jahren |
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dscomm-frame.kicad_pcb
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Bump revision numbers, dates, and copyright pending release to manufacturing.
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vor 3 Jahren |
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dscomm-panel.kicad_pcb
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Add standoff holes towards the middle of panels to allow more support.
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vor 3 Jahren |
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dscomm-panel.pro
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Bump revision numbers, dates, and copyright pending release to manufacturing.
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vor 3 Jahren |
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dscomm-stencil.kicad_pcb
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Regenerate foil apertures to match panel corrections near J4 connector.
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vor 3 Jahren |
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dscomm-stencil.pro
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Bump revision numbers, dates, and copyright pending release to manufacturing.
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vor 3 Jahren |
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dscomm-tstjig.kicad_pcb
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Bump revision numbers, dates, and copyright pending release to manufacturing.
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vor 3 Jahren |
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dscomm-tstjig.pro
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Add mounting holes to the test jig and avoid upside down text in panels.
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vor 3 Jahren |
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dscomm.kicad_pcb
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Resolve #172 by adding a connector conformant with Qwiic and Stemma sensors.
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vor 3 Jahren |
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dscomm.net
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Resolve #172 by adding a connector conformant with Qwiic and Stemma sensors.
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vor 3 Jahren |
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dscomm.pro
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Correct recent tolerance configuration with redundant via diamters.
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vor 3 Jahren |
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dscomm.sch
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Bump revision numbers, dates, and copyright pending release to manufacturing.
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vor 3 Jahren |
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elabdev-black.kicad_wks
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Include more project boilerplate structure and library cache.
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vor 3 Jahren |
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elabdev-white.kicad_wks
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Include more project boilerplate structure and library cache.
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vor 3 Jahren |
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feat-mchip.sch
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Resolve #172 by adding a connector conformant with Qwiic and Stemma sensors.
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vor 3 Jahren |
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form-arduino.kicad_pcb
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Increment identifiers to indicate the new year after the spring festival.
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vor 3 Jahren |
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form-arduino.pro
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Complete milestone 'Blank FR4 design' for remaining device formats.
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vor 3 Jahren |
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form-arduino.sch
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Bump revision numbers, dates, and copyright pending release to manufacturing.
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vor 3 Jahren |
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form-beagle.kicad_pcb
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Increment identifiers to indicate the new year after the spring festival.
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vor 3 Jahren |
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form-beagle.pro
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Complete milestone 'Blank FR4 design' for remaining device formats.
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vor 3 Jahren |
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form-beagle.sch
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Bump revision numbers, dates, and copyright pending release to manufacturing.
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vor 3 Jahren |
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form-bmicro.kicad_pcb
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Increment identifiers to indicate the new year after the spring festival.
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vor 3 Jahren |
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form-bmicro.pro
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Redevelop, correct corners, and add connections to format variants.
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vor 3 Jahren |
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form-bmicro.sch
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Bump revision numbers, dates, and copyright pending release to manufacturing.
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vor 3 Jahren |
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form-frdm.kicad_pcb
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Increment identifiers to indicate the new year after the spring festival.
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vor 3 Jahren |
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form-frdm.pro
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Redevelop, correct corners, and add connections to format variants.
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vor 3 Jahren |
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form-frdm.sch
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Bump revision numbers, dates, and copyright pending release to manufacturing.
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vor 3 Jahren |
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fp-lib-table
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Redesign for STM32WL SoC architecture, add features, and bump version.
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vor 3 Jahren |
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pwr-stmicro.sch
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Bump revision numbers, dates, and copyright pending release to manufacturing.
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vor 3 Jahren |
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rfsw-mchip.sch
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Partially resolve #55 by reducing vias and severed traces in the RF path.
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vor 3 Jahren |
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rfsw-stmicro.sch
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Bump revision numbers, dates, and copyright pending release to manufacturing.
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vor 3 Jahren |
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sym-lib-table
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Integrate local symbols and footprint libraries pending components.
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vor 3 Jahren |
