Europalab Devices produces a LoRaWAN transmitting client node, specialised for higher research of actuator and sensor assisted IoT networks. https://dev.europalab.com/nlnet/20200000/
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Michael Schloh von Bennewitz 8a7168e2be Complete resolution of #172 by adding a bill of materials part entry. hace 3 años
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billofmat Complete resolution of #172 by adding a bill of materials part entry. hace 3 años
fabplace Backport decrease of luminosity modification for D3/R40 power LED pair. hace 3 años
fabprint Complete resolution of #172 by adding a bill of materials part entry. hace 3 años
libraries Modify deprecated secure element model to new ATECC608B throughout. hace 3 años
modules Solve the problem causing a layout error (79794b0) in the part footprint. hace 3 años
.gitignore Include positions for forthcoming tool configuration and machine import. hace 3 años
LICENSE Add project infrastructure files corresponding to hardware engineering. hace 4 años
conn-mchip.sch Modify and consolidate both ferrite beads according to manufacturer advice. hace 3 años
conn-stmicro.sch Bump revision numbers, dates, and copyright pending release to manufacturing. hace 3 años
ctrl-mchip.sch Replace 1K value with 2K4 for R40 to dim power indicator LED D3. hace 3 años
ctrl-stmicro.sch Bump revision numbers, dates, and copyright pending release to manufacturing. hace 3 años
dscomm-cache.lib Implement design review suggestions to resolve #61 and #62. hace 3 años
dscomm-frame.kicad_pcb Bump revision numbers, dates, and copyright pending release to manufacturing. hace 3 años
dscomm-panel.kicad_pcb Add standoff holes towards the middle of panels to allow more support. hace 3 años
dscomm-panel.pro Bump revision numbers, dates, and copyright pending release to manufacturing. hace 3 años
dscomm-stencil.kicad_pcb Regenerate foil apertures to match panel corrections near J4 connector. hace 3 años
dscomm-stencil.pro Bump revision numbers, dates, and copyright pending release to manufacturing. hace 3 años
dscomm-tstjig.kicad_pcb Bump revision numbers, dates, and copyright pending release to manufacturing. hace 3 años
dscomm-tstjig.pro Add mounting holes to the test jig and avoid upside down text in panels. hace 3 años
dscomm.kicad_pcb Resolve #172 by adding a connector conformant with Qwiic and Stemma sensors. hace 3 años
dscomm.net Resolve #172 by adding a connector conformant with Qwiic and Stemma sensors. hace 3 años
dscomm.pro Correct recent tolerance configuration with redundant via diamters. hace 3 años
dscomm.sch Bump revision numbers, dates, and copyright pending release to manufacturing. hace 3 años
elabdev-black.kicad_wks Include more project boilerplate structure and library cache. hace 3 años
elabdev-white.kicad_wks Include more project boilerplate structure and library cache. hace 3 años
feat-mchip.sch Resolve #172 by adding a connector conformant with Qwiic and Stemma sensors. hace 3 años
form-arduino.kicad_pcb Increment identifiers to indicate the new year after the spring festival. hace 3 años
form-arduino.pro Complete milestone 'Blank FR4 design' for remaining device formats. hace 3 años
form-arduino.sch Bump revision numbers, dates, and copyright pending release to manufacturing. hace 3 años
form-beagle.kicad_pcb Increment identifiers to indicate the new year after the spring festival. hace 3 años
form-beagle.pro Complete milestone 'Blank FR4 design' for remaining device formats. hace 3 años
form-beagle.sch Bump revision numbers, dates, and copyright pending release to manufacturing. hace 3 años
form-bmicro.kicad_pcb Increment identifiers to indicate the new year after the spring festival. hace 3 años
form-bmicro.pro Redevelop, correct corners, and add connections to format variants. hace 3 años
form-bmicro.sch Bump revision numbers, dates, and copyright pending release to manufacturing. hace 3 años
form-frdm.kicad_pcb Increment identifiers to indicate the new year after the spring festival. hace 3 años
form-frdm.pro Redevelop, correct corners, and add connections to format variants. hace 3 años
form-frdm.sch Bump revision numbers, dates, and copyright pending release to manufacturing. hace 3 años
fp-lib-table Redesign for STM32WL SoC architecture, add features, and bump version. hace 3 años
pwr-stmicro.sch Bump revision numbers, dates, and copyright pending release to manufacturing. hace 3 años
rfsw-mchip.sch Partially resolve #55 by reducing vias and severed traces in the RF path. hace 3 años
rfsw-stmicro.sch Bump revision numbers, dates, and copyright pending release to manufacturing. hace 3 años
sym-lib-table Integrate local symbols and footprint libraries pending components. hace 3 años