#31 RF layers lack via stiching

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abierta hace 4 años por Michael Schloh von Bennewitz · 1 comentarios

RF layers lack via stiching

Problem environment

Radio circuits resonate and reflect against copper according to induction, and it's beneficial to neutralise such interference.

Steps to reproduce

  1. Display the layout design
  2. Observe large copper areas
  3. Search for via stiching

Expected result

Via stiching should be present.

Actual result

Via stiching is not present.

Severity level

This is low priority because project requirements imply a research level device.

# RF layers lack via stiching ## Problem environment Radio circuits resonate and reflect against copper according to induction, and it's beneficial to neutralise such interference. ## Steps to reproduce 1. Display the layout design 2. Observe large copper areas 3. Search for via stiching ## Expected result Via stiching should be present. ## Actual result Via stiching is not present. ## Severity level This is **low priority** because project requirements imply a research level device.
Michael Schloh von Bennewitz ha añadido esto al hito Postproject catchall hace 4 años ' issues.change_milestone_at=`modificó el hito de %!s(MISSING) a %!s(MISSING) %!s(MISSING)
Michael Schloh von Bennewitz ha añadido la etiqueta
enhancement
hace 4 años
Michael Schloh von Bennewitz ha añadido la etiqueta
invalid
hace 4 años

Mostly (all RF sensitive feed line areas) solved in 0904bbd.

Mostly (all RF sensitive feed line areas) solved in 0904bbd.
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