#31 RF layers lack via stiching

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Michael Schloh von Bennewitz4 년 전을 오픈 · 1개의 코멘트

RF layers lack via stiching

Problem environment

Radio circuits resonate and reflect against copper according to induction, and it's beneficial to neutralise such interference.

Steps to reproduce

  1. Display the layout design
  2. Observe large copper areas
  3. Search for via stiching

Expected result

Via stiching should be present.

Actual result

Via stiching is not present.

Severity level

This is low priority because project requirements imply a research level device.

# RF layers lack via stiching ## Problem environment Radio circuits resonate and reflect against copper according to induction, and it's beneficial to neutralise such interference. ## Steps to reproduce 1. Display the layout design 2. Observe large copper areas 3. Search for via stiching ## Expected result Via stiching should be present. ## Actual result Via stiching is not present. ## Severity level This is **low priority** because project requirements imply a research level device.
Michael Schloh von Bennewitz Postproject catchall 4 년 전 마일스톤을 추가하였습니다.
Michael Schloh von Bennewitz added the
enhancement
label 4 년 전
Michael Schloh von Bennewitz added the
invalid
label 4 년 전
Michael Schloh von Bennewitz 코멘트됨, 4 년 전
소유자

Mostly (all RF sensitive feed line areas) solved in 0904bbd.

Mostly (all RF sensitive feed line areas) solved in 0904bbd.
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