#31 RF layers lack via stiching

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Michael Schloh von Bennewitz4 年前创建 · 1 条评论

RF layers lack via stiching

Problem environment

Radio circuits resonate and reflect against copper according to induction, and it's beneficial to neutralise such interference.

Steps to reproduce

  1. Display the layout design
  2. Observe large copper areas
  3. Search for via stiching

Expected result

Via stiching should be present.

Actual result

Via stiching is not present.

Severity level

This is low priority because project requirements imply a research level device.

# RF layers lack via stiching ## Problem environment Radio circuits resonate and reflect against copper according to induction, and it's beneficial to neutralise such interference. ## Steps to reproduce 1. Display the layout design 2. Observe large copper areas 3. Search for via stiching ## Expected result Via stiching should be present. ## Actual result Via stiching is not present. ## Severity level This is **low priority** because project requirements imply a research level device.
Michael Schloh von Bennewitz 4 年前 添加了里程碑 Postproject catchall
Michael Schloh von Bennewitz 添加了标签
enhancement
4 年前
Michael Schloh von Bennewitz 添加了标签
invalid
4 年前

Mostly (all RF sensitive feed line areas) solved in 0904bbd.

Mostly (all RF sensitive feed line areas) solved in 0904bbd.
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