#31 RF layers lack via stiching

Slēgta
Michael Schloh von Bennewitz atvēra pirms 4 gadiem · 1 komentāri

RF layers lack via stiching

Problem environment

Radio circuits resonate and reflect against copper according to induction, and it's beneficial to neutralise such interference.

Steps to reproduce

  1. Display the layout design
  2. Observe large copper areas
  3. Search for via stiching

Expected result

Via stiching should be present.

Actual result

Via stiching is not present.

Severity level

This is low priority because project requirements imply a research level device.

# RF layers lack via stiching ## Problem environment Radio circuits resonate and reflect against copper according to induction, and it's beneficial to neutralise such interference. ## Steps to reproduce 1. Display the layout design 2. Observe large copper areas 3. Search for via stiching ## Expected result Via stiching should be present. ## Actual result Via stiching is not present. ## Severity level This is **low priority** because project requirements imply a research level device.
Michael Schloh von Bennewitz pievienoja atskaites punktu Postproject catchall pirms 4 gadiem
Michael Schloh von Bennewitz pievienoja etiķeti
enhancement
pirms 4 gadiem
Michael Schloh von Bennewitz pievienoja etiķeti
invalid
pirms 4 gadiem

Mostly (all RF sensitive feed line areas) solved in 0904bbd.

Mostly (all RF sensitive feed line areas) solved in 0904bbd.
Pierakstieties, lai pievienotos šai sarunai.
Nav atskaites punktu
Nav atbildīgo
1 dalībnieki
Izpildes termiņš

Izpildes termiņš nav uzstādīts.

Atkarības

Šai problēmai pagaidām nav nevienas atkarības.

Notiek ielāde…
Atcelt
Saglabāt
Vēl nav satura.