#31 RF layers lack via stiching

Kapalı
Michael Schloh von Bennewitz tarafından 4 yıl önce açıldı · 1 yorum

RF layers lack via stiching

Problem environment

Radio circuits resonate and reflect against copper according to induction, and it's beneficial to neutralise such interference.

Steps to reproduce

  1. Display the layout design
  2. Observe large copper areas
  3. Search for via stiching

Expected result

Via stiching should be present.

Actual result

Via stiching is not present.

Severity level

This is low priority because project requirements imply a research level device.

# RF layers lack via stiching ## Problem environment Radio circuits resonate and reflect against copper according to induction, and it's beneficial to neutralise such interference. ## Steps to reproduce 1. Display the layout design 2. Observe large copper areas 3. Search for via stiching ## Expected result Via stiching should be present. ## Actual result Via stiching is not present. ## Severity level This is **low priority** because project requirements imply a research level device.
Michael Schloh von Bennewitz 4 yıl önce Postproject catchall kilometre taşına ekledi
Michael Schloh von Bennewitz 4 yıl önce
enhancement
etiketini ekledi
Michael Schloh von Bennewitz 4 yıl önce
invalid
etiketini ekledi

Mostly (all RF sensitive feed line areas) solved in 0904bbd.

Mostly (all RF sensitive feed line areas) solved in 0904bbd.
Bu konuşmaya katılmak için oturum aç.
Kilometre Taşı Yok
Atanan Kişi Yok
1 Katılımcı
Bitiş Tarihi

Bitiş tarihi atanmadı.

Bağımlılıklar

Bu konu henüz bir bağımlılık içermiyor.

Yükleniyor…
İptal
Kaydet
Henüz bir içerik yok.